产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM-HPC |
| CPU |
Intel® Xeon® D-2899NT (22 x 2.2 GHz, 30 MB cache, 100G Eth, 135W)
Intel® Xeon® D-2712T (4 x 1.9 GHz, 15 MB cache, 50G Eth, 65W)
Intel® Xeon® D-2733NT (8 x 2.1 GHz, 15 MB cache, 50G Eth, 80W)
Intel® Xeon® D-2752TER (12 x 1.8 GHz, 20 MB cache, 50G Eth, 77W)
Intel® Xeon® D-2775TE (16 x 2.0 GHz, 25 MB cache, 100G Eth, 100W)
Intel® Xeon® D-2796TE (20 x 2.0 GHz, 30 MB cache, 100G Eth, 118W)
|
| DRAM | 4x DIMM sockets for DDR4 memory modules | Max. capacity = 512GB* *Optional 8 sockets on Size E, up to 1TB |
| Ethernet |
1 x 2.5GbE TSN Ethernet
2x 40G / 4x 25G / 8x 10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb (depending on CPU)
|
| I/O Interfaces |
32 x PCIe Gen4
16 x PCIe Gen3
4 x USB 3.0
4 x USB 2.0
2 x SATA III (6Gb/s)
2 x UART
12 x GPIOs
2 x SM-Bus
2 x I²C bus
|
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features |
AMI Aptio UEFI
64Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
Flash Update
|
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0)
|
| Power Management |
ACPI 5.0 with battery support
|
| Operating Systems |
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Microsoft® Windows IoT 10 Core
Linux
Android
Yocto
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
Industrial: Operating Temperature: -40 to +80°C | Storage Temperature: -40 to +80°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Size | 160 x 160 mm Optional available on Size E, 200 x 160mm |
订购资讯
| P/N | Product name | Description |
| 050900 | conga-HPC/sILH-D2796TE | COM-HPC Size D module based on Intel® Xeon® D-2796TE 20-core processor with 2.0 GHz, 30MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. |
| 050901 | conga-HPC/sILH-D2775TE | COM-HPC Size D module based on Intel® Xeon® D-2775TE 16-core processor with 2.0 GHz, 25MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. |
| 050902 | conga-HPC/sILH-D2752TER | COM-HPC Size D module based on Intel® Xeon® D-2752TER 12-core processor with 1.8 GHz, 20MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. |
| 050910 | conga-HPC/sILH-D2733NT | COM-HPC Size D module based on Intel® Xeon® D-2733NT 8-core processor with 2.1 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range. |
| 050911 | conga-HPC/sILH-D2712T | COM-HPC Size D module based on Intel® Xeon® D-2712T 4-core processor with 1.9 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range. |
| 050995 | conga-HPC/sILH-D2796TE DPLL | COM-HPC Size D module based on Intel® Xeon® D-2796TE 20-core processor with 2.0 GHz, 30MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. With DPLL option for ITU-T Synchronous Ethernet (SyncE) and IEEE1588 PTP support. |
| 050996 | conga-HPC/sILH-D2775TE DPLL | COM-HPC Size D module based on Intel® Xeon® D-2775TE 16-core processor with 2.0 GHz, 25MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. With DPLL option for ITU-T Synchronous Ethernet (SyncE) and IEEE1588 PTP support. |
| 050912 | conga-HPC/sILH-D2899NT | COM-HPC Size D module based on Intel® Xeon® D-2899NT 22-core processor with 2.2 GHz, 30MB cache and quad channel DDR4 3200 MT/s memory interface (formerly Ice Lake-D HCC Refresh). Commercial temperature range. |
相关配件
| P/N | Product name | Description |
| 050950 | conga-HPC/sILH-CSA-HP-B | Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 050951 | conga-HPC/sILH-CSA-HP-T | Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5. |
| 050952 | conga-HPC/sILH-HSP-HP-B | Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 050953 | conga-HPC/sILH-HSP-HP-T | Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. |
| 050954 | conga-HPC/sILH-HPA-B | Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 050955 | conga-HPC/sILH-HPA-T | Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Threaded mounting with threaded standoffs M2.5. |
| 050956 | conga-HPC/sILH-Retention Frame | Retention frame for conga-HPC/sILH |
| 065500 | conga-HPC/EVAL-Server | conga-HPC/EVAL-Server |
| 065505 | conga-HPC/LEK-C827-IM 4SFP28 | COM_HPC Mezzanine card with Intel C827-IM and 4xSFP28, 4x25G configuration |
| 065506 | conga-HPC/LEK-C827-IM 8SFP+ | COM_HPC Mezzanine card with 2x Intel C827-IM and 8xSFP+, 8x10G configuration |
| 065508 | conga-HPC/LEK-C827-IM 2QSFP28 | COM_HPC Mezzanine card with Intel C827-IM and 2xQSFP28, 2x100G, 8x10G (Breakout mode) configuration |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-HPC/sILH
2024/10/30
Manual
User’s Guide for conga-HPC/sILH
2024/12/04
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM-HPC |
| CPU |
Intel® Xeon® D-2899NT (22 x 2.2 GHz, 30 MB cache, 100G Eth, 135W)
Intel® Xeon® D-2712T (4 x 1.9 GHz, 15 MB cache, 50G Eth, 65W)
Intel® Xeon® D-2733NT (8 x 2.1 GHz, 15 MB cache, 50G Eth, 80W)
Intel® Xeon® D-2752TER (12 x 1.8 GHz, 20 MB cache, 50G Eth, 77W)
Intel® Xeon® D-2775TE (16 x 2.0 GHz, 25 MB cache, 100G Eth, 100W)
Intel® Xeon® D-2796TE (20 x 2.0 GHz, 30 MB cache, 100G Eth, 118W)
|
| DRAM | 4x DIMM sockets for DDR4 memory modules | Max. capacity = 512GB* *Optional 8 sockets on Size E, up to 1TB |
| Ethernet |
1 x 2.5GbE TSN Ethernet
2x 40G / 4x 25G / 8x 10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb (depending on CPU)
|
| I/O Interfaces |
32 x PCIe Gen4
16 x PCIe Gen3
4 x USB 3.0
4 x USB 2.0
2 x SATA III (6Gb/s)
2 x UART
12 x GPIOs
2 x SM-Bus
2 x I²C bus
|
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features |
AMI Aptio UEFI
64Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
Flash Update
|
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0)
|
| Power Management |
ACPI 5.0 with battery support
|
| Operating Systems |
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Microsoft® Windows IoT 10 Core
Linux
Android
Yocto
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
Industrial: Operating Temperature: -40 to +80°C | Storage Temperature: -40 to +80°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Size | 160 x 160 mm Optional available on Size E, 200 x 160mm |
订购资讯
| P/N | Product name | Description |
| 050900 | conga-HPC/sILH-D2796TE | COM-HPC Size D module based on Intel® Xeon® D-2796TE 20-core processor with 2.0 GHz, 30MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. |
| 050901 | conga-HPC/sILH-D2775TE | COM-HPC Size D module based on Intel® Xeon® D-2775TE 16-core processor with 2.0 GHz, 25MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. |
| 050902 | conga-HPC/sILH-D2752TER | COM-HPC Size D module based on Intel® Xeon® D-2752TER 12-core processor with 1.8 GHz, 20MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. |
| 050910 | conga-HPC/sILH-D2733NT | COM-HPC Size D module based on Intel® Xeon® D-2733NT 8-core processor with 2.1 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range. |
| 050911 | conga-HPC/sILH-D2712T | COM-HPC Size D module based on Intel® Xeon® D-2712T 4-core processor with 1.9 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range. |
| 050995 | conga-HPC/sILH-D2796TE DPLL | COM-HPC Size D module based on Intel® Xeon® D-2796TE 20-core processor with 2.0 GHz, 30MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. With DPLL option for ITU-T Synchronous Ethernet (SyncE) and IEEE1588 PTP support. |
| 050996 | conga-HPC/sILH-D2775TE DPLL | COM-HPC Size D module based on Intel® Xeon® D-2775TE 16-core processor with 2.0 GHz, 25MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. With DPLL option for ITU-T Synchronous Ethernet (SyncE) and IEEE1588 PTP support. |
| 050912 | conga-HPC/sILH-D2899NT | COM-HPC Size D module based on Intel® Xeon® D-2899NT 22-core processor with 2.2 GHz, 30MB cache and quad channel DDR4 3200 MT/s memory interface (formerly Ice Lake-D HCC Refresh). Commercial temperature range. |
相关配件
| P/N | Product name | Description |
| 050950 | conga-HPC/sILH-CSA-HP-B | Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 050951 | conga-HPC/sILH-CSA-HP-T | Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5. |
| 050952 | conga-HPC/sILH-HSP-HP-B | Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 050953 | conga-HPC/sILH-HSP-HP-T | Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. |
| 050954 | conga-HPC/sILH-HPA-B | Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 050955 | conga-HPC/sILH-HPA-T | Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Threaded mounting with threaded standoffs M2.5. |
| 050956 | conga-HPC/sILH-Retention Frame | Retention frame for conga-HPC/sILH |
| 065500 | conga-HPC/EVAL-Server | conga-HPC/EVAL-Server |
| 065505 | conga-HPC/LEK-C827-IM 4SFP28 | COM_HPC Mezzanine card with Intel C827-IM and 4xSFP28, 4x25G configuration |
| 065506 | conga-HPC/LEK-C827-IM 8SFP+ | COM_HPC Mezzanine card with 2x Intel C827-IM and 8xSFP+, 8x10G configuration |
| 065508 | conga-HPC/LEK-C827-IM 2QSFP28 | COM_HPC Mezzanine card with Intel C827-IM and 2xQSFP28, 2x100G, 8x10G (Breakout mode) configuration |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-HPC/sILH
2024/10/30
Manual
User’s Guide for conga-HPC/sILH
2024/12/04