产品介绍
产品规格
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产品介绍
产品规格
Item | Description |
Formfactor | SMARC |
CPU |
NXP i.MX8 QuadXPlus (4, ARM Cortex-A35, 1x ARM Cortex-M4F, 4W)
|
DRAM | Up to 4 GByte onboard LPDDR4 memory | 2400 MT/s |
Ethernet |
2 x Gigabit Ethernet
|
I/O Interfaces |
5 x USB 2.0 (shared with 1x USB OTG client)
GPIOs
2 x FlexCAN
up to 4x UART (2x with Handshake (1x shared with FlexCAN)
USB 2.0
1 x eSPI
1 x SPI
I²C bus
1 x PCI Express™ 3.0 lanes
1 x SDIO 3.0
1 x USB 3.0
optional M.2 1216 WiFi module (soldered down)
|
Graphics | Integrated in NXP i.MX8-X Series single GT7000Lite multimedia GPU VPU up to 4K h.265 dec / 1080p h.264 enc/dec) | 3D Graphics with up to 4 high performance vec4 shaders and 16 execution units up to 2 independent displays | OpenGL ES 3.1 | Vulcan VX extensions | OpenCL 1.2 EP | OpenVG 1.1i |
Item | Description |
Security | High Assurance Boot support | Inline Encryption Engine (AES-128) TNG, AES-128, AES-256, 3DES, ARC4, RSA4096, SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 4096 |
Operating Systems |
Android
Linux
Yocto
|
Video Interfaces |
1 x dual channel or 2x single channel LVDS 24 bit | 2x MIPI-DSI with 4-lanes shared with LVDS | 1x MIPI-CSI 4-lanes
|
Size |
82 x 50 mm (3,23” x 1,97”)
|
订购资讯
P/N | Product name | Description |
051110 | conga-SMX8-X/i-QXP-4G eMMC16 | SMARC 2.0 module ultra low power NXP i.MX8 QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range. |
051113 | conga-SMX8-X/i-QXP-2G eMMC16 | SMARC 2.0 module with ultra low-power NXP i.MX8-X QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range. |
相关配件
P/N | Product name | Description |
051150 | conga-SMX8-X/i-CSP-B | *Passive cooling solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. *All standoffs are with 2.7mm bore hole. |
051151 | conga-SMX8-X/i-HSP-B | * Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. * All standoffs are with 2.7mm bore hole. |
007010 | conga-SEVAL | Evaluation carrier board for SMARC modules. |
020750 | conga-SMC1/SMARC-ARM | 3.5’’ carrier board for congatec SMARC modules based on ARM architecture. |
资讯下载
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
Item | Description |
Formfactor | SMARC |
CPU |
NXP i.MX8 QuadXPlus (4, ARM Cortex-A35, 1x ARM Cortex-M4F, 4W)
|
DRAM | Up to 4 GByte onboard LPDDR4 memory | 2400 MT/s |
Ethernet |
2 x Gigabit Ethernet
|
I/O Interfaces |
5 x USB 2.0 (shared with 1x USB OTG client)
GPIOs
2 x FlexCAN
up to 4x UART (2x with Handshake (1x shared with FlexCAN)
USB 2.0
1 x eSPI
1 x SPI
I²C bus
1 x PCI Express™ 3.0 lanes
1 x SDIO 3.0
1 x USB 3.0
optional M.2 1216 WiFi module (soldered down)
|
Graphics | Integrated in NXP i.MX8-X Series single GT7000Lite multimedia GPU VPU up to 4K h.265 dec / 1080p h.264 enc/dec) | 3D Graphics with up to 4 high performance vec4 shaders and 16 execution units up to 2 independent displays | OpenGL ES 3.1 | Vulcan VX extensions | OpenCL 1.2 EP | OpenVG 1.1i |
Item | Description |
Security | High Assurance Boot support | Inline Encryption Engine (AES-128) TNG, AES-128, AES-256, 3DES, ARC4, RSA4096, SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 4096 |
Operating Systems |
Android
Linux
Yocto
|
Video Interfaces |
1 x dual channel or 2x single channel LVDS 24 bit | 2x MIPI-DSI with 4-lanes shared with LVDS | 1x MIPI-CSI 4-lanes
|
Size |
82 x 50 mm (3,23” x 1,97”)
|
订购资讯
P/N | Product name | Description |
051110 | conga-SMX8-X/i-QXP-4G eMMC16 | SMARC 2.0 module ultra low power NXP i.MX8 QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range. |
051113 | conga-SMX8-X/i-QXP-2G eMMC16 | SMARC 2.0 module with ultra low-power NXP i.MX8-X QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range. |
相关配件
P/N | Product name | Description |
051150 | conga-SMX8-X/i-CSP-B | *Passive cooling solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. *All standoffs are with 2.7mm bore hole. |
051151 | conga-SMX8-X/i-HSP-B | * Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. * All standoffs are with 2.7mm bore hole. |
007010 | conga-SEVAL | Evaluation carrier board for SMARC modules. |
020750 | conga-SMC1/SMARC-ARM | 3.5’’ carrier board for congatec SMARC modules based on ARM architecture. |
资讯下载