

conga-STDA4
SMARC Module based on TI Processors TDA4VM and DRA829J
- SMARC Module based on TI TDA4VM application processor and DRA829J Arm® networking processor
- Heterogenous architecture with dual Arm® Cortex®-A72, DSP and accelerators for deep learning and multimedia
- Arm® Cortex®-R5F MCUs to offload real-time communication
- Highest reliability for harsh environment applications
- Industrial temperature range -40°C to +85°C
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
Item | Description |
Formfactor | SMARC |
CPU |
TI DRA829J (2x 2.0GHz ARM Cortex-A72, 6x 1.0GHz ARM Cortex-R5F)
TI TDA4VM (2x 2.0GHz ARM Cortex-A72, 6x 1.0GHz ARM Cortex-R5F)
|
DRAM | Up to 8 GB onboard LPDDR4x memory | 3733 MT/s | inline ECC Up to 8 MB of on-chip L3 RAM with ECC and coherency | 512KB on-chip SRAM in MAIN domain, protected by ECC |
Ethernet |
2x Gbit Ethernet with IEEE 1588 support
|
I/O Interfaces |
1 x dual-role USB 2.0
2 x USB 2.0
2 x USB 3.0
1 x SDIO 3.0
2x PCIe 3.0 x1 + 1x PCIe 3.0 x2 or up to 4x PCIe 3.0 x1 |
2 x GP I²C
2 x SPI
4 x UART (2x with Handshake)
2 x CAN FD
14 x GPIOs
optional full industrial onboard UbloxWiFi/BT module
2 x I2S
|
Mass storage | eMMC 5.1 up to 128 GB configurable as pseudo-SLC |
Graphics | Integrated in SoC | Graphics Accelerator 3D GPU PowerVR Rogue 8XE GE8430 | up to 1x Ultra-HD or 4x Full-HD 60fps display resolution | Up to 4 concurrent displays | VPU up to 4k60p H.264/H.265 decode / 1080p60 H.264 encode | OpenGL ES 3.1 | OpenVX | OpenCL |
Security | Customer programmable root key, up to RSA-4K or ECC-512 | Crypto hardware accelerators, PKA with ECC, AES, SHA, RNG, DES and 3DES | Secure boot with secure runtime support | SHE, Encryption Engine AES-128, AES-256, TRNG, SHA-1, SHA-2, SHA-256, MD-5 | RSA- |
Item | Description |
Boot Loader | U-Boot boot loader |
Operating Systems |
Linux
QNX
RTOS
|
Temperature | Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C |
Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
Video Interfaces |
1x dual channel 24-bit LVDS | 1x Display Port 1.4 supports up to 4 1080p60 displays via MST | optional 1x MIPI-DSI 4-lane shared with LVDS | 2x MIPI-CSI | up to 2x integrated Image Signal Processor (ISP) for MIPI-CSI camera on TDV4VM
|
Features |
Watchdog Timer
Console Port
High Precision Real Time Clock
|
AI & Deep Learning |
Deep-learning Matrix Multiply Accelerator Accelerators (MMA) with up to 8 TOPS (8b)
C7x floating point, vector DSP with up to 80 GFLOPs
Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
Depth and Motion Processing Accelerators (DMPAC)
|
Size |
82 x 50 mm (3,23” x 1,97”)
|
订购资讯
P/N | Product name | Description |
051510 | conga-STDA4/i-TDA4VM-4G eMMC32 | SMARC Module based on high-performance industrial TI TDA4VM Arm® Application processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA(deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C |
051511 | conga-STDA4/i-TDA4VM-2G eMMC32 | SMARC Module based on high-performance industrial TI TDA4VM Arm® Application processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA(deep-learning matrix multiply accelerator), 2GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C. |
051512 | conga-STDA4/i-DRA829J-4G eMMC32 | SMARC Module based on high-performance industrial TI DRA829J Arm® Networking processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA(deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C. |
051513 | conga-STDA4/i-DRA829J-2G eMMC32 | SMARC Module based on high-performance industrial TI DRA829J Arm® Networking processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA(deep-learning matrix multiply accelerator), 2GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C |
051520 | conga-STDA4/i-TDA4VM-2G eMMC32 MAYA-W26 | SMARC Module based on high-performance industrial TI TDA4VM Arm® Application processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA(deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Features Ublox Wifi/BT module MAYA-W260. Industrial grade temperature range from -40°C to 85°C. |
相关配件
P/N | Product name | Description |
051550 | conga-STDA4/CSP-B | Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM Jacinto 7 ARM processor. All standoffs are with 2.7mm bore hole. |
051551 | conga-STDA4/HSP-B | Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM Jacinto 7 ARM processor. All standoffs are with 2.7mm bore hole. |
050060 | SMARC/CSA Adapter | Active cooling solution adapter for SMARC modules used in combination with module heat spreader. |
007010 | conga-SEVAL | Evaluation carrier board for SMARC modules. |
020750 | conga-SMC1/SMARC-ARM | 3.5’’ carrier board for congatec SMARC modules based on ARM architecture. |
资讯下载
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
Item | Description |
Formfactor | SMARC |
CPU |
TI DRA829J (2x 2.0GHz ARM Cortex-A72, 6x 1.0GHz ARM Cortex-R5F)
TI TDA4VM (2x 2.0GHz ARM Cortex-A72, 6x 1.0GHz ARM Cortex-R5F)
|
DRAM | Up to 8 GB onboard LPDDR4x memory | 3733 MT/s | inline ECC Up to 8 MB of on-chip L3 RAM with ECC and coherency | 512KB on-chip SRAM in MAIN domain, protected by ECC |
Ethernet |
2x Gbit Ethernet with IEEE 1588 support
|
I/O Interfaces |
1 x dual-role USB 2.0
2 x USB 2.0
2 x USB 3.0
1 x SDIO 3.0
2x PCIe 3.0 x1 + 1x PCIe 3.0 x2 or up to 4x PCIe 3.0 x1 |
2 x GP I²C
2 x SPI
4 x UART (2x with Handshake)
2 x CAN FD
14 x GPIOs
optional full industrial onboard UbloxWiFi/BT module
2 x I2S
|
Mass storage | eMMC 5.1 up to 128 GB configurable as pseudo-SLC |
Graphics | Integrated in SoC | Graphics Accelerator 3D GPU PowerVR Rogue 8XE GE8430 | up to 1x Ultra-HD or 4x Full-HD 60fps display resolution | Up to 4 concurrent displays | VPU up to 4k60p H.264/H.265 decode / 1080p60 H.264 encode | OpenGL ES 3.1 | OpenVX | OpenCL |
Security | Customer programmable root key, up to RSA-4K or ECC-512 | Crypto hardware accelerators, PKA with ECC, AES, SHA, RNG, DES and 3DES | Secure boot with secure runtime support | SHE, Encryption Engine AES-128, AES-256, TRNG, SHA-1, SHA-2, SHA-256, MD-5 | RSA- |
Item | Description |
Boot Loader | U-Boot boot loader |
Operating Systems |
Linux
QNX
RTOS
|
Temperature | Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C |
Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
Video Interfaces |
1x dual channel 24-bit LVDS | 1x Display Port 1.4 supports up to 4 1080p60 displays via MST | optional 1x MIPI-DSI 4-lane shared with LVDS | 2x MIPI-CSI | up to 2x integrated Image Signal Processor (ISP) for MIPI-CSI camera on TDV4VM
|
Features |
Watchdog Timer
Console Port
High Precision Real Time Clock
|
AI & Deep Learning |
Deep-learning Matrix Multiply Accelerator Accelerators (MMA) with up to 8 TOPS (8b)
C7x floating point, vector DSP with up to 80 GFLOPs
Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
Depth and Motion Processing Accelerators (DMPAC)
|
Size |
82 x 50 mm (3,23” x 1,97”)
|
订购资讯
P/N | Product name | Description |
051510 | conga-STDA4/i-TDA4VM-4G eMMC32 | SMARC Module based on high-performance industrial TI TDA4VM Arm® Application processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA(deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C |
051511 | conga-STDA4/i-TDA4VM-2G eMMC32 | SMARC Module based on high-performance industrial TI TDA4VM Arm® Application processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA(deep-learning matrix multiply accelerator), 2GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C. |
051512 | conga-STDA4/i-DRA829J-4G eMMC32 | SMARC Module based on high-performance industrial TI DRA829J Arm® Networking processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA(deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C. |
051513 | conga-STDA4/i-DRA829J-2G eMMC32 | SMARC Module based on high-performance industrial TI DRA829J Arm® Networking processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA(deep-learning matrix multiply accelerator), 2GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C |
051520 | conga-STDA4/i-TDA4VM-2G eMMC32 MAYA-W26 | SMARC Module based on high-performance industrial TI TDA4VM Arm® Application processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA(deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Features Ublox Wifi/BT module MAYA-W260. Industrial grade temperature range from -40°C to 85°C. |
相关配件
P/N | Product name | Description |
051550 | conga-STDA4/CSP-B | Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM Jacinto 7 ARM processor. All standoffs are with 2.7mm bore hole. |
051551 | conga-STDA4/HSP-B | Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM Jacinto 7 ARM processor. All standoffs are with 2.7mm bore hole. |
050060 | SMARC/CSA Adapter | Active cooling solution adapter for SMARC modules used in combination with module heat spreader. |
007010 | conga-SEVAL | Evaluation carrier board for SMARC modules. |
020750 | conga-SMC1/SMARC-ARM | 3.5’’ carrier board for congatec SMARC modules based on ARM architecture. |
资讯下载