



conga-TC175
COM Express Type 6 Compact module based on 7th Generation Intel® Core™ processor family
- 7th Generation Intel® Core™ SOC processor
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- Low power consumption (TDP 15W, cTDP 7.5W)
- Up to 32 GByte dual channel DDR4 memory
产品介绍
产品规格
订购资讯
相关配件
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产品介绍
产品规格
Item | Description |
Formfactor | COM Express Compact |
CPU |
Intel® Core™ i7-7600U (2 x 2.8 GHz, 4MB cache, 15W)
Intel® Core™ i5-7300U (2 x 2.6 GHz, 3MB cache, 15W)
Intel® Core™ i3-7100U (2 x 2.4 GHz, 3MB cache, 15W)
Intel® Celeron® 3965U (2 x 2.2 GHz, 2MB cache, 15W)
|
DRAM | 2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32 GByte dual channel |
Ethernet |
Intel® i219-LM GbE LAN Controller with AMT 11.6 support
|
I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
3 x Serial ATA® Gen 3 (can be configured as RAID)
4 x USB 3.0
8 x USB 2.0 (XHCI)
LPC bus (no DMA)
I²C bus (fast mode, 400 kHz, multi-master)
2 x UART
|
Graphics | Intel® Gen9 HD Graphics Engine OpenCL 2.0/2.1, OpenGL 4.4/4.5 and DirectX12 (for Windows 10) support | up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encoding |
congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control |
embedded BIOS Features |
AMI AptioV® UEFI 2.x firmware
8/16 MByte serial SPI firmware flash
|
Item | Description |
Security |
The conga-TC175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
|
Power Management |
ACPI 4.0 with battery support
|
Operating Systems |
Microsoft® Windows 10 (64bit only)
Fedora 24
Ubuntu
SuSe
Red Hat Enterprise
Yocto Project v2.2
Chromium 2
Wind River VxWorks
Microsoft® Windows 10 IoT Enterprise (64bit only)
|
Temperature |
Standard Operating: 0 to +60°C Storage: -20 to +80°C
|
Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
Video Interfaces |
2x DDI / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA (optional)
Dual channel LVDS transmitter, Supports flat panels 2×24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920×1200 Automatic Panel Detection via EDID/EPI
|
Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
P/N | Product name | Description |
045250 | TC175/i7-7600U | COM Express Type 6 Compact module with Intel® Core™ i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U). |
045251 | TC175/i5-7300U | COM Express Type 6 Compact module with Intel® Core™ i5-7300U dual core processor with 2.6GHz up to 3.5GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U). |
045252 | TC175/i3-7100U | COM Express Type 6 Compact module with Intel® Core™ i3-7100U dual core processor with 2.4GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U). |
045253 | TC175/3965U | COM Express Type 6 Compact module with Intel® Celeron® 3965U dual core processor with 2.2GHz, 2MB Intel® Smart Cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U). |
相关配件
P/N | Product name | Description |
045230 | TC170/HSP-B | Standard Heatspreader for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are with 2.7mm bore hole. |
045231 | TC170/HSP-T | Standard Heatspreader for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M 2.5 threaded. |
045232 | TC170/CSP-B | Passive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are with 2.7mm bore hole. |
045233 | TC170/CSP-T | Passive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M2.5 threaded. |
045234 | TC170/CSA-B | Active cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. Through hole mounting with bore hole standoffs Ø2.7mm, 15mm fins, 24mm overall cooling height and integrated 12V fan |
045235 | TC170/CSA-T | Active cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M2.5 threaded, 15mm fins, 24mm overall cooling height and integrated 12V fan |
0065800 | conga-TEVAL | Evaluation carrier board for Type 6 COM Express modules |
0011115 | conga-LDVI/EPI | LVDS to DVI converter board for digital flat panels with onboard EEPROM |
资讯下载
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
Item | Description |
Formfactor | COM Express Compact |
CPU |
Intel® Core™ i7-7600U (2 x 2.8 GHz, 4MB cache, 15W)
Intel® Core™ i5-7300U (2 x 2.6 GHz, 3MB cache, 15W)
Intel® Core™ i3-7100U (2 x 2.4 GHz, 3MB cache, 15W)
Intel® Celeron® 3965U (2 x 2.2 GHz, 2MB cache, 15W)
|
DRAM | 2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32 GByte dual channel |
Ethernet |
Intel® i219-LM GbE LAN Controller with AMT 11.6 support
|
I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
3 x Serial ATA® Gen 3 (can be configured as RAID)
4 x USB 3.0
8 x USB 2.0 (XHCI)
LPC bus (no DMA)
I²C bus (fast mode, 400 kHz, multi-master)
2 x UART
|
Graphics | Intel® Gen9 HD Graphics Engine OpenCL 2.0/2.1, OpenGL 4.4/4.5 and DirectX12 (for Windows 10) support | up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encoding |
congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control |
embedded BIOS Features |
AMI AptioV® UEFI 2.x firmware
8/16 MByte serial SPI firmware flash
|
Item | Description |
Security |
The conga-TC175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
|
Power Management |
ACPI 4.0 with battery support
|
Operating Systems |
Microsoft® Windows 10 (64bit only)
Fedora 24
Ubuntu
SuSe
Red Hat Enterprise
Yocto Project v2.2
Chromium 2
Wind River VxWorks
Microsoft® Windows 10 IoT Enterprise (64bit only)
|
Temperature |
Standard Operating: 0 to +60°C Storage: -20 to +80°C
|
Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
Video Interfaces |
2x DDI / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA (optional)
Dual channel LVDS transmitter, Supports flat panels 2×24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920×1200 Automatic Panel Detection via EDID/EPI
|
Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
P/N | Product name | Description |
045250 | TC175/i7-7600U | COM Express Type 6 Compact module with Intel® Core™ i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U). |
045251 | TC175/i5-7300U | COM Express Type 6 Compact module with Intel® Core™ i5-7300U dual core processor with 2.6GHz up to 3.5GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U). |
045252 | TC175/i3-7100U | COM Express Type 6 Compact module with Intel® Core™ i3-7100U dual core processor with 2.4GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U). |
045253 | TC175/3965U | COM Express Type 6 Compact module with Intel® Celeron® 3965U dual core processor with 2.2GHz, 2MB Intel® Smart Cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U). |
相关配件
P/N | Product name | Description |
045230 | TC170/HSP-B | Standard Heatspreader for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are with 2.7mm bore hole. |
045231 | TC170/HSP-T | Standard Heatspreader for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M 2.5 threaded. |
045232 | TC170/CSP-B | Passive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are with 2.7mm bore hole. |
045233 | TC170/CSP-T | Passive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M2.5 threaded. |
045234 | TC170/CSA-B | Active cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. Through hole mounting with bore hole standoffs Ø2.7mm, 15mm fins, 24mm overall cooling height and integrated 12V fan |
045235 | TC170/CSA-T | Active cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M2.5 threaded, 15mm fins, 24mm overall cooling height and integrated 12V fan |
0065800 | conga-TEVAL | Evaluation carrier board for Type 6 COM Express modules |
0011115 | conga-LDVI/EPI | LVDS to DVI converter board for digital flat panels with onboard EEPROM |
资讯下载