conga-TC370
COM Express Type 6 Compact module based on 8th Generation Intel® Core™ processor family
- 8th Generation Intel® Core™ SOC processor
- Up to 4 cores at low-power TDP of 15W
- New Intel® Gen 9 HD Graphics
- Optional eMMC 5.1 on board mass storage
- COM Express Compact Type 6 module 95×95 mm²
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Compact |
| CPU |
Intel® Core™ i7-8665UE (4 x 1.7 GHz, 8MB cache, 15W)
Intel® Core™ i5-8365UE (4 x 1.6 GHz, 6MB cache, 15W)
Intel® Core™ i3-8145UE (2 x 2.2 GHz, 4MB cache, 15W)
Intel® Celeron® 4305UE (2 x 2.0 GHz, 2MB cache, 15W)
|
| DRAM | Dual channel DDR4 up to 2400 MT/s | 2x SO-DIMM | up to 2x 32 Gbyte |
| Ethernet |
1x Gigabit Ethernet | Intel i219LM
|
| I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
3 x Serial ATA® Gen 3 (can be configured as RAID)
4 x USB 3.1 Gen2
8 x USB 2.0
LPC bus (no DMA)
I²C bus
2 x UART
|
| Graphics | Intel® Gen9 HD Graphics Engine with OpenCL 2.1, OpenGL 4.5 and DirectX12 (for Windows 10) support up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.4 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features |
AMI Aptio® 4.X (UEFI) BIOS
SM-BIOS
BIOS Update
Logo Boot
Quiet Boot
HDD Password
|
| Item | Description |
| Security |
TPM 2.0 Infineon SLB9670
|
| Operating Systems |
Microsoft® Windows® 10 (64bit only)
Microsoft® Windows 10 IoT Enterprise (64bit only)
Linux
|
| Temperature |
Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
|
| Extended Temperature | Screening service on request: -25 to +80°C (burn-in & cold-soak) | -40 to +85°C (burn-in & cold-soak) |
| Humidity | Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond. |
| Video Interfaces |
2x DDI | 18/24bit single/dual channel LVDS or eDP | optional VGA interface | LVDS interface with optional eDP overlay. Configuration of display mode by software
|
| Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
| P/N | Product name | Description |
| 048800 | TC370/i7-8665UE | COM Express Type 6 Compact module based on Intel® Core™ i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel® UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (Intel W hiskey Lake). |
| 048801 | TC370/i5-8365UE | COM Express Type 6 Compact module based on Intel® Core™ i5-8365UE 4-core processor with 1.6GHz up to 4.1GHz turbo boost, 6MB L2 cache, Intel® UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (Intel Whiskey Lake). |
| 048802 | TC370/i3-8145UE | COM Express Type 6 Compact module based on Intel® Core™ i3-8145UE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 4MB L2 cache, Intel® UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (Intel W hiskey Lake). |
| 048804 | TC370/4305UE | COM Express Type 6 Compact module based on Intel® Celeron™ 4305UE 2-core processor with 2.0GHz, 2MB L2 cache, Intel® UHD Graphics 610 and dual channel DDR4 2133 MT/s memory interface (Intel W hiskey Lake). |
相关配件
| P/N | Product name | Description |
| 048850 | TC370/CSA-HP-B | Standard active cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes, 25.5mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 048851 | TC370/CSA-HP-T | Standard active cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes, 25.5mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5. |
| 048852 | TC370/CSP-HP-B | Standard passive cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes and 24.3mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 048853 | TC370/CSP-HP-T | Standard passive cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes and 24.3mm overall cooling height. Threaded mounting with threaded standoffs M2.5. |
| 048854 | TC370/HSP-HP-B | Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 048855 | TC370/HSP-HP-T | Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. |
| 0065800 | conga-TEVAL | Evaluation carrier board for Type 6 COM Express modules |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TC370
2024/11/21
Manual
User’s Guide for conga-TC370
2024/11/11
Manual
Post Code List
2015/06/15
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Compact |
| CPU |
Intel® Core™ i7-8665UE (4 x 1.7 GHz, 8MB cache, 15W)
Intel® Core™ i5-8365UE (4 x 1.6 GHz, 6MB cache, 15W)
Intel® Core™ i3-8145UE (2 x 2.2 GHz, 4MB cache, 15W)
Intel® Celeron® 4305UE (2 x 2.0 GHz, 2MB cache, 15W)
|
| DRAM | Dual channel DDR4 up to 2400 MT/s | 2x SO-DIMM | up to 2x 32 Gbyte |
| Ethernet |
1x Gigabit Ethernet | Intel i219LM
|
| I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
3 x Serial ATA® Gen 3 (can be configured as RAID)
4 x USB 3.1 Gen2
8 x USB 2.0
LPC bus (no DMA)
I²C bus
2 x UART
|
| Graphics | Intel® Gen9 HD Graphics Engine with OpenCL 2.1, OpenGL 4.5 and DirectX12 (for Windows 10) support up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.4 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features |
AMI Aptio® 4.X (UEFI) BIOS
SM-BIOS
BIOS Update
Logo Boot
Quiet Boot
HDD Password
|
| Item | Description |
| Security |
TPM 2.0 Infineon SLB9670
|
| Operating Systems |
Microsoft® Windows® 10 (64bit only)
Microsoft® Windows 10 IoT Enterprise (64bit only)
Linux
|
| Temperature |
Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
|
| Extended Temperature | Screening service on request: -25 to +80°C (burn-in & cold-soak) | -40 to +85°C (burn-in & cold-soak) |
| Humidity | Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond. |
| Video Interfaces |
2x DDI | 18/24bit single/dual channel LVDS or eDP | optional VGA interface | LVDS interface with optional eDP overlay. Configuration of display mode by software
|
| Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
| P/N | Product name | Description |
| 048800 | TC370/i7-8665UE | COM Express Type 6 Compact module based on Intel® Core™ i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel® UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (Intel W hiskey Lake). |
| 048801 | TC370/i5-8365UE | COM Express Type 6 Compact module based on Intel® Core™ i5-8365UE 4-core processor with 1.6GHz up to 4.1GHz turbo boost, 6MB L2 cache, Intel® UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (Intel Whiskey Lake). |
| 048802 | TC370/i3-8145UE | COM Express Type 6 Compact module based on Intel® Core™ i3-8145UE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 4MB L2 cache, Intel® UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (Intel W hiskey Lake). |
| 048804 | TC370/4305UE | COM Express Type 6 Compact module based on Intel® Celeron™ 4305UE 2-core processor with 2.0GHz, 2MB L2 cache, Intel® UHD Graphics 610 and dual channel DDR4 2133 MT/s memory interface (Intel W hiskey Lake). |
相关配件
| P/N | Product name | Description |
| 048850 | TC370/CSA-HP-B | Standard active cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes, 25.5mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 048851 | TC370/CSA-HP-T | Standard active cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes, 25.5mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5. |
| 048852 | TC370/CSP-HP-B | Standard passive cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes and 24.3mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 048853 | TC370/CSP-HP-T | Standard passive cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes and 24.3mm overall cooling height. Threaded mounting with threaded standoffs M2.5. |
| 048854 | TC370/HSP-HP-B | Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 048855 | TC370/HSP-HP-T | Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. |
| 0065800 | conga-TEVAL | Evaluation carrier board for Type 6 COM Express modules |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TC370
2024/11/21
Manual
User’s Guide for conga-TC370
2024/11/11
Manual
Post Code List
2015/06/15