conga-TC570r
COM Express Type 6 Compact module based on 11th Gen Intel® Core™ processor family (code name “Tiger Lake”) and soldered down memory
- Embedded/Industrial use condition
- Extended temperature options available
- PCI Express Gen 4
- Up to 32 GByte dual channel LPDDR4X soldered down memory with 4266 MT/ s IBECC
- AI/DL Instruction Sets including VNNI
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Compact |
| CPU |
Intel® Celeron® 6305E (2 x 1.8 GHz, 4MB cache, 15W)
Intel® Core™ i7-1185GRE (4 x 1.8 GHz, 12 MB cache, 15W)
Intel® Core™ i5-1145GRE (4 x 1.5 GHz, 8 MB cache, 15W)
Intel® Core™ i3-1115GRE (2 x 2.2 GHz, 6 MB cache, 15W)
|
| DRAM | Up to 32 GByte LPDDR4X 4266MT/s SDRAM | memory down | dual channel IBECC |
| Ethernet |
1 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series
|
| I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
PEG support x4 (PCIe Gen4)
4 x USB 3.1 Gen2
8 x USB 2.0
2 x SATA III (6Gb/s)
SPI
2 x UART
8 x GPIOs
|
| Graphics | Integrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4 |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0)
|
| Power Management |
ACPI 5.0 with battery support
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces |
3x DDI/DP++ | eDP/LVDS | VGA (optional)
|
| Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
| P/N | Product name | Description |
| 050330 | TC570r/i7-1185GRE-32G | COM Express Type 6 Compact module based on Intel® Core™ i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and 32 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. |
| 050331 | TC570r/i5-1145GRE-16G | COM Express Type 6 Compact module based on Intel® Core™ i5-1145GRE 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and 16GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. |
| 050332 | TC570r/i3-1115GRE-8G | COM Express Type 6 Compact module based on Intel® Core™ i3-1115G4E 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® UHD Graphics with 48EU and 8 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. |
| 050320 | TC570r/6305E-4G | COM Express Type 6 Compact module based on Intel® Celeron® 6305E 2-core processor with 1.8GHz, 4MB cache, Intel® UHD Graphics with 48EU and 4 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Commercial temperature range. |
相关配件
| P/N | Product name | Description |
| 050350 | TC570/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 0050351 | TC570/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 050352 | TC570/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050353 | TC570/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050354 | TC570/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050355 | TC570/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. |
| 65810 | conga-TEVAL/COMe 3.0 | Evaluation Carrier Board for COM Express Type 6 modules. |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TC570r
2024/10/30
Manual
User’s Guide for conga-TC570r
2024/11/11
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Compact |
| CPU |
Intel® Celeron® 6305E (2 x 1.8 GHz, 4MB cache, 15W)
Intel® Core™ i7-1185GRE (4 x 1.8 GHz, 12 MB cache, 15W)
Intel® Core™ i5-1145GRE (4 x 1.5 GHz, 8 MB cache, 15W)
Intel® Core™ i3-1115GRE (2 x 2.2 GHz, 6 MB cache, 15W)
|
| DRAM | Up to 32 GByte LPDDR4X 4266MT/s SDRAM | memory down | dual channel IBECC |
| Ethernet |
1 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series
|
| I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
PEG support x4 (PCIe Gen4)
4 x USB 3.1 Gen2
8 x USB 2.0
2 x SATA III (6Gb/s)
SPI
2 x UART
8 x GPIOs
|
| Graphics | Integrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4 |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0)
|
| Power Management |
ACPI 5.0 with battery support
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces |
3x DDI/DP++ | eDP/LVDS | VGA (optional)
|
| Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
| P/N | Product name | Description |
| 050330 | TC570r/i7-1185GRE-32G | COM Express Type 6 Compact module based on Intel® Core™ i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and 32 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. |
| 050331 | TC570r/i5-1145GRE-16G | COM Express Type 6 Compact module based on Intel® Core™ i5-1145GRE 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and 16GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. |
| 050332 | TC570r/i3-1115GRE-8G | COM Express Type 6 Compact module based on Intel® Core™ i3-1115G4E 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® UHD Graphics with 48EU and 8 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. |
| 050320 | TC570r/6305E-4G | COM Express Type 6 Compact module based on Intel® Celeron® 6305E 2-core processor with 1.8GHz, 4MB cache, Intel® UHD Graphics with 48EU and 4 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Commercial temperature range. |
相关配件
| P/N | Product name | Description |
| 050350 | TC570/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 0050351 | TC570/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 050352 | TC570/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050353 | TC570/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050354 | TC570/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050355 | TC570/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. |
| 65810 | conga-TEVAL/COMe 3.0 | Evaluation Carrier Board for COM Express Type 6 modules. |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TC570r
2024/10/30
Manual
User’s Guide for conga-TC570r
2024/11/11