conga-TC700
COM Express Type 6 Compact module based on Intel® Core™ Ultra processors (code name “Meteor Lake”)
- Intel® performance hybrid architecture with up to 16 cores and 22 threads
- Integrated Intel® Arc™ Graphics – entry level discrete graphics performance up to 128EUs
- Intel® AI Boost – Integrated NPU accelerator
- Up to 96 GB RAM with in-band ECC
- PCI Express Gen 4 | USB 4
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Compact |
| CPU |
Intel® Core™ Ultra 5-135H (4 P-cores 1.7GHz up to 4.6GHz, 8 E-Cores 1.2GHz up to 3.6GHz, 18MB cache)
Intel® Core™ Ultra 5-125U (2 P-cores 1.3Ghz up to 4.3GHz, 8 E-Cores 0.8GHz up to 3.6GHz, 12MB cache)
Intel® Core™ Ultra 7-155U (2 P-cores 1.7Ghz up to 4.8GHz, 8 E-Cores 1.2GHz up to 3.8GHz, 12MB cache)
Intel® Core™ Ultra 5-125H (4 P-cores 1.2GHz up to 4.5GHz, 8 E-Cores 0.7GHz up to 3.6GHz, 18MB cache)
Intel® Core™ Ultra 7-155H (6 P-cores 1.4Ghz up to 4.8GHz, 8 E-Cores 0.9GHz up to 3.8GHz, 24MB cache)
|
| DRAM | 2 SO-DIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) |up to 5600 MT/s | in-band ECC |
| Ethernet |
2.5 GbE with TSN support via Intel® i226 Ethernet controller series
|
| I/O Interfaces |
Up to 8 PCIe Gen5 PEG (H-Series) or up to 2×4 PCIe Gen4 PEG (U-Series)
up to 8 PCIe Gen4
up to 2x USB4
4x USB 3.2 Gen2 (incl. USB 2.0) + 8x USB 2.0
up to 2x SATA
2 x UART
GPIOs
SPI
LPC
SM-Bus
I²C
|
| Mass storage | NVMe x4 SSD (optional) up to 1 TB capacity |
| Graphics | Intel® Arc™ Graphics architecture | up to 8 Xᵉ Cores with 128 EUs |
| NPU/AI Acceleration | Integrated NPU accelerator on all part numbers |
| congatec Board Controller | Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code |
| embedded BIOS Features |
AMI Aptio® UEFI firmware
64Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
|
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0)
|
| Power Management |
ACPI 6.0 with battery support
|
| Operating Systems |
Microsoft® Windows 11 IoT Enterprise
Microsoft® Windows 11
Microsoft® Windows 10 IoT Enterprise
Linux
Yocto
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C
|
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces |
Up to 3x DDI (2x shared with USB4)
LVDS or eDP
4 x independent displays up to 8k
|
| Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
| P/N | Product name | Description |
| 045700 | conga-TC700/ultra7-155H | COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.4Ghz up to 4.8GHz (turbo) | E-Cores 0.9GHz up to 3.8GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 24MB Intel® Smart Cache | Intel® Arc™ graphics with 8 X e cores (128 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 28W Base-TDP | Intel® code name Meteor Lake-H |
| 045701 | conga-TC700/ultra5-135H | COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 4 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.7GHz up to 4.6GHz (turbo) | E-cores 1.2GHz up to 3.6GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 18MB Intel® Smart Cache | Intel® Arc™ graphics with 8 Xe cores (128 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 28W Base TDP | Intel® code name Meteor Lake-H |
| 045702 | conga-TC700/ultra5-125H | COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 4 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.2GHz up to 4.5GHz (turbo) | E-cores 0.7GHz up to 3.6GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 18MB Intel® Smart Cache | Intel® Arc™ graphics with 7 X e cores (112 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 28W Base-TDP | Intel® code name Meteor Lake-H |
| 045710 | conga-TC700/ultra7-155U | COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.7Ghz up to 4.8GHz (turbo) | E-cores 1.2GHz up to 3.8GHz (turbo) | Low Power E-cores up to 2.1GHz (turbo) | Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 15W Base-TDP | Intel® code name Meteor Lake-U |
| 045711 | conga-TC700/ultra5-125U | COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.3Ghz up to 4.3GHz (turbo) | E-cores 0.8GHz up to 3.6GHz (turbo) | Low Power E-cores up to 2.1GHz (turbo) | Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 15W Base-TDP | Intel® code name Meteor Lake-U |
相关配件
| P/N | Product name | Description |
| 045750 | conga-TC700/CSA-HP-B | Standard active cooling solution for high performance COM Express module congaTC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole |
| 045751 | conga-TC700/CSA-HP-T | Standard active cooling solution for high performance COM Express module congaTC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded. |
| 045752 | conga-TC700/CSP-HP-B | Standard passive cooling solution for high performance COM Express module congaTC700 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole. |
| 045753 | conga-TC700/CSP-HP-T | Standard passive cooling solution for high performance COM Express module congaTC700 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded |
| 045754 | conga-TC700/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole. |
| 045755 | conga-TC700/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. |
| 065810 | conga-TEVAL/COMe 3.0 | Evaluation Carrier Board for COM Express Type 6 modules. |
| 065820 | conga-TEVAL/COMe 3.1 | Evaluation carrier board for COM Express Type 6 revision 3.1 modules. |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TC700
2024/07/25
Manual
User’s Guide for conga-TC700
2024/01/10
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Compact |
| CPU |
Intel® Core™ Ultra 5-135H (4 P-cores 1.7GHz up to 4.6GHz, 8 E-Cores 1.2GHz up to 3.6GHz, 18MB cache)
Intel® Core™ Ultra 5-125U (2 P-cores 1.3Ghz up to 4.3GHz, 8 E-Cores 0.8GHz up to 3.6GHz, 12MB cache)
Intel® Core™ Ultra 7-155U (2 P-cores 1.7Ghz up to 4.8GHz, 8 E-Cores 1.2GHz up to 3.8GHz, 12MB cache)
Intel® Core™ Ultra 5-125H (4 P-cores 1.2GHz up to 4.5GHz, 8 E-Cores 0.7GHz up to 3.6GHz, 18MB cache)
Intel® Core™ Ultra 7-155H (6 P-cores 1.4Ghz up to 4.8GHz, 8 E-Cores 0.9GHz up to 3.8GHz, 24MB cache)
|
| DRAM | 2 SO-DIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) |up to 5600 MT/s | in-band ECC |
| Ethernet |
2.5 GbE with TSN support via Intel® i226 Ethernet controller series
|
| I/O Interfaces |
Up to 8 PCIe Gen5 PEG (H-Series) or up to 2×4 PCIe Gen4 PEG (U-Series)
up to 8 PCIe Gen4
up to 2x USB4
4x USB 3.2 Gen2 (incl. USB 2.0) + 8x USB 2.0
up to 2x SATA
2 x UART
GPIOs
SPI
LPC
SM-Bus
I²C
|
| Mass storage | NVMe x4 SSD (optional) up to 1 TB capacity |
| Graphics | Intel® Arc™ Graphics architecture | up to 8 Xᵉ Cores with 128 EUs |
| NPU/AI Acceleration | Integrated NPU accelerator on all part numbers |
| congatec Board Controller | Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code |
| embedded BIOS Features |
AMI Aptio® UEFI firmware
64Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
|
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0)
|
| Power Management |
ACPI 6.0 with battery support
|
| Operating Systems |
Microsoft® Windows 11 IoT Enterprise
Microsoft® Windows 11
Microsoft® Windows 10 IoT Enterprise
Linux
Yocto
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C
|
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces |
Up to 3x DDI (2x shared with USB4)
LVDS or eDP
4 x independent displays up to 8k
|
| Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
| P/N | Product name | Description |
| 045700 | conga-TC700/ultra7-155H | COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.4Ghz up to 4.8GHz (turbo) | E-Cores 0.9GHz up to 3.8GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 24MB Intel® Smart Cache | Intel® Arc™ graphics with 8 X e cores (128 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 28W Base-TDP | Intel® code name Meteor Lake-H |
| 045701 | conga-TC700/ultra5-135H | COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 4 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.7GHz up to 4.6GHz (turbo) | E-cores 1.2GHz up to 3.6GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 18MB Intel® Smart Cache | Intel® Arc™ graphics with 8 Xe cores (128 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 28W Base TDP | Intel® code name Meteor Lake-H |
| 045702 | conga-TC700/ultra5-125H | COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 4 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.2GHz up to 4.5GHz (turbo) | E-cores 0.7GHz up to 3.6GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 18MB Intel® Smart Cache | Intel® Arc™ graphics with 7 X e cores (112 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 28W Base-TDP | Intel® code name Meteor Lake-H |
| 045710 | conga-TC700/ultra7-155U | COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.7Ghz up to 4.8GHz (turbo) | E-cores 1.2GHz up to 3.8GHz (turbo) | Low Power E-cores up to 2.1GHz (turbo) | Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 15W Base-TDP | Intel® code name Meteor Lake-U |
| 045711 | conga-TC700/ultra5-125U | COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.3Ghz up to 4.3GHz (turbo) | E-cores 0.8GHz up to 3.6GHz (turbo) | Low Power E-cores up to 2.1GHz (turbo) | Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 15W Base-TDP | Intel® code name Meteor Lake-U |
相关配件
| P/N | Product name | Description |
| 045750 | conga-TC700/CSA-HP-B | Standard active cooling solution for high performance COM Express module congaTC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole |
| 045751 | conga-TC700/CSA-HP-T | Standard active cooling solution for high performance COM Express module congaTC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded. |
| 045752 | conga-TC700/CSP-HP-B | Standard passive cooling solution for high performance COM Express module congaTC700 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole. |
| 045753 | conga-TC700/CSP-HP-T | Standard passive cooling solution for high performance COM Express module congaTC700 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded |
| 045754 | conga-TC700/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole. |
| 045755 | conga-TC700/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. |
| 065810 | conga-TEVAL/COMe 3.0 | Evaluation Carrier Board for COM Express Type 6 modules. |
| 065820 | conga-TEVAL/COMe 3.1 | Evaluation carrier board for COM Express Type 6 revision 3.1 modules. |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TC700
2024/07/25
Manual
User’s Guide for conga-TC700
2024/01/10