产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Compact |
| CPU |
AMD Ryzen™ Embedded 8640U (6 cores 3.2GHz up to 4.9GHz, 22MB cache)
AMD Ryzen™ Embedded 8645HS (6 cores 4.3GHz up to 5GHz, 22MB cache)
AMD Ryzen™ Embedded 8840U (8 cores 3.3GHz up to 5.1GHz, 24MB cache)
AMD Ryzen™ Embedded 8845HS (8 cores 3.8GHz up to 5.1GHz, 24MB cache)
|
| DRAM | 2 SO-DIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) |up to 5600 MT/s | ECC (option) |
| Ethernet |
2.5 GbE via Intel® i226 Ethernet controller series
|
| I/O Interfaces |
4 x USB 3.2 Gen2
4 x USB 2.0
2 x SATA 6Gb/s (if NVMe™ SSD option is not used)
6 x PCIe Gen4 (8 lanes)
PEG x8 Gen4
1 x I²C bus
1 x GPSPI
2 x UART
8 x GPIO
1 x SM-Bus
1 x LPC
|
| Mass storage | NVMe™ SSD up to 1 TB capacity (option instead of SATA ports) |
| Graphics | Integrated AMD Radeon™ RDNA™ 3 Graphics with up to 6x WGPs (12 CUs) |
| NPU/AI Acceleration | Integrated XDNA™ NPU with up to 16 TOPs | Up to 39 TOPs total SoC performance |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features |
AMI Aptio® UEFI firmware
32 Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
|
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard
|
| Power Management |
ACPI 6.0 with battery support
|
| Operating Systems |
Microsoft® Windows 11
Microsoft® Windows 11 IoT Enterprise
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Linux
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C
|
| Humidity | Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond. |
| Video Interfaces |
Up to 3x DDI
LVDS or eDP
4 x independent displays
|
| Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
| P/N | Product name | Description |
| 051700 | conga-TCR8/8845HS | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8845HS with 8 cores | 3.8GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
| 051701 | conga-TCR8/8840U | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8840U with 8 cores | 3.3GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
| 051702 | conga-TCR8/8645HS | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8645HS with 6 cores | 4.3GHz up to 5.0GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
| 051703 | conga-TCR8/8640U | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8640U with 6 cores | 3.2GHz up to 4.9GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
相关配件
| P/N | Product name | Description |
| 051750 | conga-TCR8/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. |
| 051751 | conga-TCR8/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded. |
| 051752 | conga-TCR8/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 051753 | conga-TCR8/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. |
| 051754 | conga-TCR8/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 051755 | conga-TCR8/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. |
| 065821 | conga-TEVAL/COMe 3.1 | Evaluation carrier board for COM Express Type 6 revision 3.1 modules |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TC700
2024/07/25
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Compact |
| CPU |
AMD Ryzen™ Embedded 8640U (6 cores 3.2GHz up to 4.9GHz, 22MB cache)
AMD Ryzen™ Embedded 8645HS (6 cores 4.3GHz up to 5GHz, 22MB cache)
AMD Ryzen™ Embedded 8840U (8 cores 3.3GHz up to 5.1GHz, 24MB cache)
AMD Ryzen™ Embedded 8845HS (8 cores 3.8GHz up to 5.1GHz, 24MB cache)
|
| DRAM | 2 SO-DIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) |up to 5600 MT/s | ECC (option) |
| Ethernet |
2.5 GbE via Intel® i226 Ethernet controller series
|
| I/O Interfaces |
4 x USB 3.2 Gen2
4 x USB 2.0
2 x SATA 6Gb/s (if NVMe™ SSD option is not used)
6 x PCIe Gen4 (8 lanes)
PEG x8 Gen4
1 x I²C bus
1 x GPSPI
2 x UART
8 x GPIO
1 x SM-Bus
1 x LPC
|
| Mass storage | NVMe™ SSD up to 1 TB capacity (option instead of SATA ports) |
| Graphics | Integrated AMD Radeon™ RDNA™ 3 Graphics with up to 6x WGPs (12 CUs) |
| NPU/AI Acceleration | Integrated XDNA™ NPU with up to 16 TOPs | Up to 39 TOPs total SoC performance |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features |
AMI Aptio® UEFI firmware
32 Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
|
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard
|
| Power Management |
ACPI 6.0 with battery support
|
| Operating Systems |
Microsoft® Windows 11
Microsoft® Windows 11 IoT Enterprise
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Linux
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C
|
| Humidity | Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond. |
| Video Interfaces |
Up to 3x DDI
LVDS or eDP
4 x independent displays
|
| Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
| P/N | Product name | Description |
| 051700 | conga-TCR8/8845HS | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8845HS with 8 cores | 3.8GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
| 051701 | conga-TCR8/8840U | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8840U with 8 cores | 3.3GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
| 051702 | conga-TCR8/8645HS | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8645HS with 6 cores | 4.3GHz up to 5.0GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
| 051703 | conga-TCR8/8640U | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8640U with 6 cores | 3.2GHz up to 4.9GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
相关配件
| P/N | Product name | Description |
| 051750 | conga-TCR8/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. |
| 051751 | conga-TCR8/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded. |
| 051752 | conga-TCR8/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 051753 | conga-TCR8/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. |
| 051754 | conga-TCR8/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 051755 | conga-TCR8/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. |
| 065821 | conga-TEVAL/COMe 3.1 | Evaluation carrier board for COM Express Type 6 revision 3.1 modules |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TC700
2024/07/25