conga-TS170
COM Express Type 6 Basic module based on 6th Generation Intel® Core™ processor family
- 6th Generation Intel® Core™ processor
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- ECC memory support for Xeon and i3 version
- Up to 32GByte dual channel DDR4 memory
- XEON processors for data center applications
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Basic |
| CPU |
Intel® Xeon™ E3-1505M V5 (4 x 2.8 GHz, 8MB cache, 45W)
Intel® Xeon™ E3-1505L V5 (4 x 2.0 GHz, 8MB cache, 25W)
Intel® Xeon® E3-1578L V5 (4 x 2.0 GHz, 8MB cache, 45W)
Intel® Xeon® E3-1558LV5 (4 x 1.9 GHz, 8MB cache, 45W)
Intel® Xeon® E3-1515MV5 (4 x 2.8 GHz, 8MB cache, 45W)
Intel® Core™ i7-6820EQ (4 x 2.8 GHz, 8MB cache, 45W)
Intel® Core™ i7-6822EQ (4 x 2.0 GHz, 8MB cache, 25W)
Intel® Core™ i5-6440EQ (4 x 2.7 GHz, 6MB cache, 45W)
Intel® Core™ i5-6442EQ (4 x 1.9 GHz, 6MB cache, 25W)
Intel® Core™ i3-6100E (2 x 2.7 GHz, 3MB cache, 35W)
Intel® Core™ i3-6102E (2 x 1.9 GHz, 3MB cache, 25W)
Intel® Celeron® G3900E (2 x 2.4 GHz, 2MB cache, 35W)
Intel® Celeron® G3902E (2 x 1.6 GHz, 2MB cache, 25W)
|
| DRAM | 2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32GByte dual channel |
| Ethernet |
Intel® i219-LM GbE LAN Controller with AMT 11 support
|
| I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
4 x SATA III (6Gb/s)
4 x USB 3.0
8 x USB 2.0
1 x PEG x16 Gen 3
LPC bus
I²C bus
2 x UART
|
| Graphics | Intel® Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3 and DirectX12 (Windows 10) support | up to three independent displays: DisplayPort 1.2 | eDP 1.3 | VGA (optional) |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control |
| embedded BIOS Features |
8/16 MByte serial SPI firmware flash
AMI AptioV® UEFI 2.x firmware
|
| Item | Description |
| Security |
The conga-TS170 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)
|
| Power Management |
ACPI 4.0 with battery support
|
| Operating Systems |
Microsoft® Windows® 10
Microsoft® Windows® 8.1
Microsoft® Windows® 7
Linux
Microsoft® Windows® embedded Standard
|
| Temperature |
Standard Operating: 0 to +60°C Storage: -20 to +80°C
|
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Size | 95 x 125 mm (3.74″ x 4.92″) |
订购资讯
| P/N | Product name | Description |
| 045900 | TS170/i7-6820EQ | COM Express Type 6 Basic module with Intel® Core™ i7-6820EQ quad core processor with 2.8GHz up to 3.5GHz, 8MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset QM170. |
| 045901 | TS170/i7-6822EQ | COM Express Type 6 Basic module with Intel® Core™ i7-6822EQ quad core processor with 2.0GHz up to 2.8GHz, 8MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset QM170. |
| 045902 | TS170/i5-6440EQ | COM Express Type 6 Basic modul Intel® Core™ i5-6440EQ quad core processor with 2.7GHz up to 3.4GHz, 6MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset QM170. |
| 045903 | TS170/i5-6442EQ | COM Express Type 6 Basic module with Intel® Core™ i5-6442EQ quad core processor with 1.9GHz up to 2.7GHz, 6MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset QM170. |
| 045904 | TS170/i3-6100E | COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset HM170. |
| 045905 | TS170/i3-6102E | COM Express Type 6 Basic module with Intel® Core™ i3-6102E dual core processor with 1.9GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset HM170. |
| 045906 | TS170/E3-1505MV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1505M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045907 | TS170/E3-1505LV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1505L V5 quad core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045908 | TS170/i3-6100E ECC | COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset CM236 with ECC memory support. |
| 045909 | TS170/i3-6102E ECC | COM Express Type 6 Basic module with Intel® Core™ i3-6102E dual core processor with 1.9GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset CM236 with ECC memory support. |
| 045910 | TS170/G3900E | COM Express Type 6 Basic module with Intel® Celeron® G3900E dual core processor with 2.4GHz, 3MB Intel® Smart Cache, Intel® HD Graphics 510 and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). |
| 045911 | TS170/G3902E | COM Express Type 6 Basic module withIntel® Celeron® G3900E dual core processor with 1.6GHz, 3MB Intel® Smart Cache, Intel® HD Graphics 510 and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). |
| 045912 | TS170/E3-1515MV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1515M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045913 | TS170/E3-1578LV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1578L V5 quad core processor with 2.0GHz up to 3.4GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045914 | TS170/E3-1558LV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1558L V5 quad core processor with 1.9GHz up to 3.3GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
相关配件
| P/N | Product name | Description |
| 045930 | TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 045931 | TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 045932 | TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 045933 | TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread. |
| 045934 | TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 045935 | TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are M2.5mm thread. |
| 0065800 | conga-TEVAL | Evaluation carrier board for Type 6 COM Express modules |
| 0011115 | conga-LDVI/EPI | LVDS to DVI converter board for digital flat panels with onboard EEPROM |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TS170
2021/03/25
Datasheet
Data Sheet for conga-TS170-HSP
2019/10/22
Datasheet
Data Sheet for conga-TS170-CSP
2019/10/23
Manual
User’s Guide for conga-TS170
2024/10/30
Manual
Post Code List
2015/06/15
Manual
Whitepaper conga-TS170
2015/11/11
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Basic |
| CPU |
Intel® Xeon™ E3-1505M V5 (4 x 2.8 GHz, 8MB cache, 45W)
Intel® Xeon™ E3-1505L V5 (4 x 2.0 GHz, 8MB cache, 25W)
Intel® Xeon® E3-1578L V5 (4 x 2.0 GHz, 8MB cache, 45W)
Intel® Xeon® E3-1558LV5 (4 x 1.9 GHz, 8MB cache, 45W)
Intel® Xeon® E3-1515MV5 (4 x 2.8 GHz, 8MB cache, 45W)
Intel® Core™ i7-6820EQ (4 x 2.8 GHz, 8MB cache, 45W)
Intel® Core™ i7-6822EQ (4 x 2.0 GHz, 8MB cache, 25W)
Intel® Core™ i5-6440EQ (4 x 2.7 GHz, 6MB cache, 45W)
Intel® Core™ i5-6442EQ (4 x 1.9 GHz, 6MB cache, 25W)
Intel® Core™ i3-6100E (2 x 2.7 GHz, 3MB cache, 35W)
Intel® Core™ i3-6102E (2 x 1.9 GHz, 3MB cache, 25W)
Intel® Celeron® G3900E (2 x 2.4 GHz, 2MB cache, 35W)
Intel® Celeron® G3902E (2 x 1.6 GHz, 2MB cache, 25W)
|
| DRAM | 2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32GByte dual channel |
| Ethernet |
Intel® i219-LM GbE LAN Controller with AMT 11 support
|
| I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
4 x SATA III (6Gb/s)
4 x USB 3.0
8 x USB 2.0
1 x PEG x16 Gen 3
LPC bus
I²C bus
2 x UART
|
| Graphics | Intel® Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3 and DirectX12 (Windows 10) support | up to three independent displays: DisplayPort 1.2 | eDP 1.3 | VGA (optional) |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control |
| embedded BIOS Features |
8/16 MByte serial SPI firmware flash
AMI AptioV® UEFI 2.x firmware
|
| Item | Description |
| Security |
The conga-TS170 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)
|
| Power Management |
ACPI 4.0 with battery support
|
| Operating Systems |
Microsoft® Windows® 10
Microsoft® Windows® 8.1
Microsoft® Windows® 7
Linux
Microsoft® Windows® embedded Standard
|
| Temperature |
Standard Operating: 0 to +60°C Storage: -20 to +80°C
|
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Size | 95 x 125 mm (3.74″ x 4.92″) |
订购资讯
| P/N | Product name | Description |
| 045900 | TS170/i7-6820EQ | COM Express Type 6 Basic module with Intel® Core™ i7-6820EQ quad core processor with 2.8GHz up to 3.5GHz, 8MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset QM170. |
| 045901 | TS170/i7-6822EQ | COM Express Type 6 Basic module with Intel® Core™ i7-6822EQ quad core processor with 2.0GHz up to 2.8GHz, 8MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset QM170. |
| 045902 | TS170/i5-6440EQ | COM Express Type 6 Basic modul Intel® Core™ i5-6440EQ quad core processor with 2.7GHz up to 3.4GHz, 6MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset QM170. |
| 045903 | TS170/i5-6442EQ | COM Express Type 6 Basic module with Intel® Core™ i5-6442EQ quad core processor with 1.9GHz up to 2.7GHz, 6MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset QM170. |
| 045904 | TS170/i3-6100E | COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset HM170. |
| 045905 | TS170/i3-6102E | COM Express Type 6 Basic module with Intel® Core™ i3-6102E dual core processor with 1.9GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset HM170. |
| 045906 | TS170/E3-1505MV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1505M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045907 | TS170/E3-1505LV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1505L V5 quad core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045908 | TS170/i3-6100E ECC | COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset CM236 with ECC memory support. |
| 045909 | TS170/i3-6102E ECC | COM Express Type 6 Basic module with Intel® Core™ i3-6102E dual core processor with 1.9GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset CM236 with ECC memory support. |
| 045910 | TS170/G3900E | COM Express Type 6 Basic module with Intel® Celeron® G3900E dual core processor with 2.4GHz, 3MB Intel® Smart Cache, Intel® HD Graphics 510 and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). |
| 045911 | TS170/G3902E | COM Express Type 6 Basic module withIntel® Celeron® G3900E dual core processor with 1.6GHz, 3MB Intel® Smart Cache, Intel® HD Graphics 510 and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). |
| 045912 | TS170/E3-1515MV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1515M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045913 | TS170/E3-1578LV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1578L V5 quad core processor with 2.0GHz up to 3.4GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045914 | TS170/E3-1558LV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1558L V5 quad core processor with 1.9GHz up to 3.3GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
相关配件
| P/N | Product name | Description |
| 045930 | TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 045931 | TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 045932 | TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 045933 | TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread. |
| 045934 | TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 045935 | TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are M2.5mm thread. |
| 0065800 | conga-TEVAL | Evaluation carrier board for Type 6 COM Express modules |
| 0011115 | conga-LDVI/EPI | LVDS to DVI converter board for digital flat panels with onboard EEPROM |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TS170
2021/03/25
Datasheet
Data Sheet for conga-TS170-HSP
2019/10/22
Datasheet
Data Sheet for conga-TS170-CSP
2019/10/23
Manual
User’s Guide for conga-TS170
2024/10/30
Manual
Post Code List
2015/06/15
Manual
Whitepaper conga-TS170
2015/11/11