conga-TS175
COM Express Type 6 Basic module based on 7th Generation Intel® Core™ processor family
- 7th Generation Intel® Core™ processor
- Intel® Xeon® processors for data center applications
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- ECC memory support
- Up to 32 GByte dual channel DDR4 memory
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Basic |
| CPU |
Intel® Xeon® E3-1505M V6 (4 x 3.0 GHz, 8MB cache, 45W)
Intel® Xeon® E3-1505L V6 (4 x 2.2 GHz, 8MB cache, 25W)
Intel® Core™ i7-7820EQ (4 x 3.0 GHz, 8MB cache, 45W)
Intel® Core™ i5-7440EQ (4 x 2.9 GHz, 6MB cache, 45W)
Intel® Core™ i5-7442EQ (4 x 2.1 GHz, 6MB cache, 25W)
Intel® Core™ i3-7100E (2 x 2.9 GHz, 3MB cache, 35W)
Intel® Core™ i3-7102E (2 x 2.1 GHz, 3MB cache, 25W)
|
| DRAM | 2 Sockets, SO-DIMM DDR4 up to 2400 MT/s and 32GByte dual channel, optionally with ECC support |
| Ethernet |
Intel® i219-LM GbE LAN Controller with AMT 11.6 support
|
| I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
4 x Serial ATA Gen 3
4 x USB 3.0
8 x USB 2.0 (XHCI)
1 x PEG x16 Gen 3
LPC bus
I²C bus (fast mode, 400 kHz, multi-master)
2 x UART
|
| Graphics | Intel® Gen9 HD Graphics Engine OpenCL 2.0/2.1, OpenGL 4.4/4.5 and DirectX12 (for Windows 10) support | up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encoding |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control |
| embedded BIOS Features |
AMI AptioV® UEFI 2.x firmware
8/16 MByte serial SPI firmware flash
|
| Item | Description |
| Security |
The conga-TS175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)
|
| Power Management |
ACPI 4.0 with battery support
|
| Operating Systems |
Microsoft® Windows 10 (64bit only)
Microsoft® Windows 10 IoT Enterprise (64bit only)
Linux
Fedora 24
Ubuntu
SuSe
Red Hat Enterprise
Yocto Project v2.2
Chromium 2
Wind River VxWorks
|
| Temperature |
Operating: 0 to +60°C Storage: -20 to +70°C
|
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces |
3x DDI / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k
Dual channel LVDS transmitter, Supports flat panels 2×24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920×1200 Automatic Panel Detection via EDID/EPI
1 x VGA (optional)
|
| Size | 95 x 125 mm (3.74″ x 4.92″) |
订购资讯
| P/N | Product name | Description |
| 045934 | conga-TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 045935 | conga-TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread. |
| 045932 | conga-TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 045933 | conga-TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread. |
| 045930 | conga-TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 045931 | conga-TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 0065800 | conga-TEVAL | Evaluation carrier board for Type 6 COM Express modules |
| 0011115 | conga-LDVI/EPI | LVDS to DVI converter board for digital flat panels with onboard EEPROM |
相关配件
| P/N | Product name | Description |
| 045934 | conga-TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 045935 | conga-TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread. |
| 045932 | conga-TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 045933 | conga-TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread. |
| 045930 | conga-TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 045931 | conga-TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 0065800 | conga-TEVAL | Evaluation carrier board for Type 6 COM Express modules |
| 0011115 | conga-LDVI/EPI | LVDS to DVI converter board for digital flat panels with onboard EEPROM |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TS175
2021/03/25
Datasheet
Data Sheet for conga-TS175-HSP
2019/10/22
Datasheet
Data Sheet for conga-TS175-CSP
2019/10/23
Manual
User’s Guide for conga-TS175
2024/10/30
Manual
Post Code List
2015/06/15
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Basic |
| CPU |
Intel® Xeon® E3-1505M V6 (4 x 3.0 GHz, 8MB cache, 45W)
Intel® Xeon® E3-1505L V6 (4 x 2.2 GHz, 8MB cache, 25W)
Intel® Core™ i7-7820EQ (4 x 3.0 GHz, 8MB cache, 45W)
Intel® Core™ i5-7440EQ (4 x 2.9 GHz, 6MB cache, 45W)
Intel® Core™ i5-7442EQ (4 x 2.1 GHz, 6MB cache, 25W)
Intel® Core™ i3-7100E (2 x 2.9 GHz, 3MB cache, 35W)
Intel® Core™ i3-7102E (2 x 2.1 GHz, 3MB cache, 25W)
|
| DRAM | 2 Sockets, SO-DIMM DDR4 up to 2400 MT/s and 32GByte dual channel, optionally with ECC support |
| Ethernet |
Intel® i219-LM GbE LAN Controller with AMT 11.6 support
|
| I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
4 x Serial ATA Gen 3
4 x USB 3.0
8 x USB 2.0 (XHCI)
1 x PEG x16 Gen 3
LPC bus
I²C bus (fast mode, 400 kHz, multi-master)
2 x UART
|
| Graphics | Intel® Gen9 HD Graphics Engine OpenCL 2.0/2.1, OpenGL 4.4/4.5 and DirectX12 (for Windows 10) support | up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encoding |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control |
| embedded BIOS Features |
AMI AptioV® UEFI 2.x firmware
8/16 MByte serial SPI firmware flash
|
| Item | Description |
| Security |
The conga-TS175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)
|
| Power Management |
ACPI 4.0 with battery support
|
| Operating Systems |
Microsoft® Windows 10 (64bit only)
Microsoft® Windows 10 IoT Enterprise (64bit only)
Linux
Fedora 24
Ubuntu
SuSe
Red Hat Enterprise
Yocto Project v2.2
Chromium 2
Wind River VxWorks
|
| Temperature |
Operating: 0 to +60°C Storage: -20 to +70°C
|
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces |
3x DDI / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k
Dual channel LVDS transmitter, Supports flat panels 2×24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920×1200 Automatic Panel Detection via EDID/EPI
1 x VGA (optional)
|
| Size | 95 x 125 mm (3.74″ x 4.92″) |
订购资讯
| P/N | Product name | Description |
| 045934 | conga-TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 045935 | conga-TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread. |
| 045932 | conga-TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 045933 | conga-TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread. |
| 045930 | conga-TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 045931 | conga-TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 0065800 | conga-TEVAL | Evaluation carrier board for Type 6 COM Express modules |
| 0011115 | conga-LDVI/EPI | LVDS to DVI converter board for digital flat panels with onboard EEPROM |
相关配件
| P/N | Product name | Description |
| 045934 | conga-TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 045935 | conga-TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread. |
| 045932 | conga-TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 045933 | conga-TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread. |
| 045930 | conga-TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 045931 | conga-TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 0065800 | conga-TEVAL | Evaluation carrier board for Type 6 COM Express modules |
| 0011115 | conga-LDVI/EPI | LVDS to DVI converter board for digital flat panels with onboard EEPROM |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TS175
2021/03/25
Datasheet
Data Sheet for conga-TS175-HSP
2019/10/22
Datasheet
Data Sheet for conga-TS175-CSP
2019/10/23
Manual
User’s Guide for conga-TS175
2024/10/30
Manual
Post Code List
2015/06/15