conga-TS570
COM Express Type 6 Basic module based on 11th Generation Intel® Core™ processor family (code name “Tiger Lake-H”)
- Embedded/Industrial use condition
- Extended temperature options available
- PCI Express Gen 4
- AI/DL Instruction Sets including VNNI
- Optional onboard NVMe SSD
- Integrated Xe (Gen 12) graphics with 32 EU
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Basic |
| CPU |
Intel® Xeon® W-11155MLE (4 x 1.8 GHz, 8 MB cache, 25W)
Intel® Xeon® W-11555MLE (6 x 1.9 GHz, 12 MB cache, 25W)
Intel® Xeon® W-11865MLE (8 x 1.5 GHz, 24 MB cache, 25W)
Intel® Xeon® W-11155MRE (4 x 2.4 GHz, 8 MB cache, 45W)
Intel® Xeon® W-11555MRE (6 x 2.6 GHz, 12 MB cache, 45W)
Intel® Xeon® W-11865MRE (8 x 2.6 GHz, 24 MB cache, 45W)
Intel® Celeron® 6600HE (2 x 2.6 GHz, 8 MB cache, 35W)
Intel® Core™ i3-11100HE (4 x 2.4 GHz, 8 MB cache, 45W)
Intel® Core™ i5-11500HE (6 x 2.6 GHz, 12 MB cache, 45W)
Intel® Core™ i7-11850HE (8 x 2.6 GHz, 24 MB cache, 45W)
|
| DRAM | Up to 3 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GByte each (96 GByte total) with 3200 MT/s |
| Ethernet |
1 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series
|
| I/O Interfaces |
8 x PCIe Gen3
LPC bus
8 x GPIOs
2 x UART
SPI
4 x SATA III (6Gb/s)
8 x USB 2.0
4 x USB 3.1 Gen2
PEG support x16 (PCIe Gen4)
I²C bus
|
| Graphics | Integrated Xe (Gen 12) graphics engine with up to 32 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4 |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features |
AMI Aptio UEFI
32 MByte serial SPI firmware flash
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
|
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0)
|
| Power Management |
ACPI 6.0 with battery support
|
| Operating Systems |
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Linux
Yocto
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Commercial: Operating: 0 to +60°C | Storage: -20 to +80°C
Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces |
3x DP/DP++ | 1x eDP /LVDS
|
| Size | 95 x 125 mm (3.74″ x 4.92″) |
订购资讯
| P/N | Product name | Description |
| 050700 | TS570/i7-11850HE | COM Express Type 6 Basic module based on Intel® Core™ i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050701 | TS570/i5-11500HE | COM Express Type 6 Basic module based on Intel® Core™ i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050702 | TS570/i3-11100HE | COM Express Type 6 Basic module based on Intel® Core™ i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050703 | TS570/6600HE | COM Express Type 6 Basic module based on Intel® Celeron 6600HE 2-core processor with 2.6GHz base frequency, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050710 | TS570/W-11865MRE | COM Express Type 6 Basic module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range -40°C to 85°C. |
| 050711 | TS570/W-11555MRE | COM Express Type 6 Basic module based on Intel® Xeon® W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range -40°C to 85°C. |
| 050712 | TS570/W-11155MRE | COM Express Type 6 Basic module based on Intel® Xeon® W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® SmartvCache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range -40°C to 85°C. |
| 050713 | TS570/W-11865MLE | COM Express Type 6 Basic module based on Intel® Xeon® W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050714 | TS570/W-11555MLE | COM Express Type 6 Basic module based on Intel® Xeon® W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050715 | TS570/W-11155MLE | COM Express Type 6 Basic module based on Intel® Xeon® W-11155MRE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
相关配件
| P/N | Product name | Description |
| 050750 | TS570/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 050751 | TS570/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 050752 | TS570/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050753 | TS570/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050754 | TS570/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050755 | TS570/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050756 | TS570/HPA | Standard heat pipe adapter for high performance COM Express module conga-TS570. |
| 065810 | conga-TEVAL/COMe 3.0 | Evaluation Carrier Board for COM Express Type 6 modules. |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TS570
2024/10/30
Manual
User’s Guide for conga-TS570
2024/11/11
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Basic |
| CPU |
Intel® Xeon® W-11155MLE (4 x 1.8 GHz, 8 MB cache, 25W)
Intel® Xeon® W-11555MLE (6 x 1.9 GHz, 12 MB cache, 25W)
Intel® Xeon® W-11865MLE (8 x 1.5 GHz, 24 MB cache, 25W)
Intel® Xeon® W-11155MRE (4 x 2.4 GHz, 8 MB cache, 45W)
Intel® Xeon® W-11555MRE (6 x 2.6 GHz, 12 MB cache, 45W)
Intel® Xeon® W-11865MRE (8 x 2.6 GHz, 24 MB cache, 45W)
Intel® Celeron® 6600HE (2 x 2.6 GHz, 8 MB cache, 35W)
Intel® Core™ i3-11100HE (4 x 2.4 GHz, 8 MB cache, 45W)
Intel® Core™ i5-11500HE (6 x 2.6 GHz, 12 MB cache, 45W)
Intel® Core™ i7-11850HE (8 x 2.6 GHz, 24 MB cache, 45W)
|
| DRAM | Up to 3 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GByte each (96 GByte total) with 3200 MT/s |
| Ethernet |
1 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series
|
| I/O Interfaces |
8 x PCIe Gen3
LPC bus
8 x GPIOs
2 x UART
SPI
4 x SATA III (6Gb/s)
8 x USB 2.0
4 x USB 3.1 Gen2
PEG support x16 (PCIe Gen4)
I²C bus
|
| Graphics | Integrated Xe (Gen 12) graphics engine with up to 32 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4 |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features |
AMI Aptio UEFI
32 MByte serial SPI firmware flash
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
|
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0)
|
| Power Management |
ACPI 6.0 with battery support
|
| Operating Systems |
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Linux
Yocto
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Commercial: Operating: 0 to +60°C | Storage: -20 to +80°C
Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces |
3x DP/DP++ | 1x eDP /LVDS
|
| Size | 95 x 125 mm (3.74″ x 4.92″) |
订购资讯
| P/N | Product name | Description |
| 050700 | TS570/i7-11850HE | COM Express Type 6 Basic module based on Intel® Core™ i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050701 | TS570/i5-11500HE | COM Express Type 6 Basic module based on Intel® Core™ i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050702 | TS570/i3-11100HE | COM Express Type 6 Basic module based on Intel® Core™ i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050703 | TS570/6600HE | COM Express Type 6 Basic module based on Intel® Celeron 6600HE 2-core processor with 2.6GHz base frequency, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050710 | TS570/W-11865MRE | COM Express Type 6 Basic module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range -40°C to 85°C. |
| 050711 | TS570/W-11555MRE | COM Express Type 6 Basic module based on Intel® Xeon® W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range -40°C to 85°C. |
| 050712 | TS570/W-11155MRE | COM Express Type 6 Basic module based on Intel® Xeon® W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® SmartvCache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range -40°C to 85°C. |
| 050713 | TS570/W-11865MLE | COM Express Type 6 Basic module based on Intel® Xeon® W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050714 | TS570/W-11555MLE | COM Express Type 6 Basic module based on Intel® Xeon® W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
| 050715 | TS570/W-11155MLE | COM Express Type 6 Basic module based on Intel® Xeon® W-11155MRE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range 0°C to 60°C. |
相关配件
| P/N | Product name | Description |
| 050750 | TS570/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 050751 | TS570/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 050752 | TS570/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050753 | TS570/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050754 | TS570/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050755 | TS570/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050756 | TS570/HPA | Standard heat pipe adapter for high performance COM Express module conga-TS570. |
| 065810 | conga-TEVAL/COMe 3.0 | Evaluation Carrier Board for COM Express Type 6 modules. |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TS570
2024/10/30
Manual
User’s Guide for conga-TS570
2024/11/11