







RugCon-RV2-T3
恩比克RugCon-RV2-T3,小型强固边缘计算电脑,可搭配英特尔® 第14/13/12代酷睿 i7/i5/i3低功耗高效能15/28瓦处理器,支持5个RJ45带锁扣网口并可选配PoE供电,1个RS232/422/485及4个USB口,8个隔离DIO,多组M.2插槽支持5G/4G/LTE/WIFI/BT通讯模组,接口螺丝锁附有效抗震,车辆点火开关及远端开关机控制,1组12V直流电源输出
- 5x 网口(M12), 可选支持2个PoE网口供电模组
- 1个串口支持(其中1x RS232/422/485)
- 4个USB口 ( 其中支持2个USB3)
- 1组音频输入输出(Mic In/Line Out)
- 4通道隔离DI,4通道隔离DO
- 2 路独立显示 (DP/DVI-D)
- 2x M.2 2280 SATAIII 用于 SSD安装,支持Raid 0/1保护
- 1xM.2 2242/3052 B key带 SIM 支持4G/5G
- 1x Full Size Mini-PCIe带 SIM支持4G/5G
- 3x M.2 Key E Type 2230 for WIFI/BT/GPS
- 可选支持1x M.2 2280 Key M(PCIe x4)可用于 AI加速卡或NVME高速SSD安装,
- DC In 6~48 V 宽电压输入支持 1路 DC Out 12V/1A 电源输出
- Ignition车载电源点火开关
- Remote 远端开关
- 可选安装MF2A MXM GPU AI算力盒
- 产品类别: 强固型工业电脑, 紧凑型强固边缘计算平台
ENBIK RugCon-RV2-T3仅宽21.1厘米,结合了坚固的外壳、低功耗、高效能计算能力和小尺寸下精确的I/O设计,特别适用于机器视觉及自动化控制。该系统还具有千兆乙太网、USB等I/O上的螺丝锁机制,以保证在冲击/振动情况下的连线。RugCon RV2-T3 推论平台是建构机器视觉边缘AI设备的理想选择,可被用于智慧工厂内并被整合进优化品管流程的智慧化自动光学检查(Automated Optical Inspection)。智慧化自动光学检查应用需运用到线性扫描相机(Line Scan Camera)及产品瑕疵辨识AI模型。在上述的智慧化应用中,透过结合合适的影像感测器与AI模型,RV2-T3运算平台可在边缘端进行实时推论作业。支援五个2.5G RJ45 LAN 、4个带PoE网口供电,让使用者能够轻松整合多个摄影机,以截取更多影像或视讯资料进行精准分析。
RugCon RV2-T3是一款低功耗和经济的人工智能加速边缘计算系统,搭载英特尔®酷睿低功耗高效能i7/i5/i3处理器。 配备5个2.5 GbE(4x PoE+可选),1个RS232/422/485,4个USB,8个隔离DIO,5 M.2通讯扩充套件插槽和其他丰富和必要的介面。 透过M.2 2280 PCIE x4扩充套件插槽,它可用于安装人工智能加速卡,使RV2-T3加速边缘人工智慧计算。在电源输入的部分提供6~48V宽压电压输入保护并可支援车辆电源点火开关及远端开关机控制,另外提供一组 12V 直流电源输出,可用于边缘端周边设备的直接协助供电。
在AI的部分, 恩比克RV2-T3支援MXM GPU算力模组,它可以灵活整合EBNIK恩比克自主研发的 MF2A MXM GPU AI算力盒,以提高AI边缘深度学习和推理能力并具备极佳的边缘AI部署成本效益。
IO Interface | ||
USB |
4 |
1x USB 3.0/USB 2.0
3x USB 2.0 |
Display |
2 |
1x DVI-D (1920 x 1200) , 1x DP(4096x 2304) |
Audio |
1 |
1x Mic-In , 1x Line Out |
LAN |
5 |
1x 2.5 GbE with TSN support,
4x 2.5 GbE with PoE+ support 802.3 af/at 25W /48V (PoE+ is option) |
COM |
6 |
1x Isolated RS232/422/485, 3x RS232/422/285, 2x RS232 |
CAN |
0 |
N/A |
DIO |
8 |
4 Channel isolated DI, 4 Channel isolated DO |
Storage | ||
M.2 |
2 |
2x M.2 2280 SATA, support Raid 0/1 |
2.5” |
0 |
N/A |
On Board Expansion | ||
Mini-PCIe
M.2 Expansion |
5 |
1x Full Size Mini-PCIe with SIM supporting 4G/5G/LTE
1x M.2 2242/3052 B key with SIM supporting 5G/LTE 3x M.2 Key E Type 2230 for BT/GPS |
M.2 2280 M key |
1 |
Optional support 1x M.2 2280 Key M ( PCIe x4 ), Support AI acceleration card/image capture card/NVME SSD, etc. |
Mechanical | ||
Mechanical | Dimension : 211(W) x 176(D) x 78(H) mm
Weight : 2.35 kg Mounting : Wall Mount |
Mechanical | ||
AI BOX | Support installing MF1A, this is ENBIK AI BOX which equipped with MXM GPU AI Card |
Environmental | ||
Operating Temp. | -25°C ~ 70°C
-40°C ~ 85°C ( Extended) |
|
Storage Temp. | -40°C ~ 85°C | |
Humidity | 0%~90% , non-condensing | |
Vibration | EN 50155:2017/ IEC 61373, Category I, Class B – Body mounted
MIL-STD-810H, Method 514.8, Category 4 |
|
Shock | EN 50155:2017/ IEC 61373, Category I, Class B – Body mounted
MIL-STD-810H, Method 516.8, Procedure I |
|
EMC | E-Mark, EN 50121 (EN 50155 EMC)
CE/FCC Class A, according to EN 55032 & EN 55035 |
Power |
1x Power Button
1x 3-pin pluggable terminal block for 6~48V DC Input , 1x 4-pin pluggable terminal block forIgnition control and Remote Control 1x 2-pin pluggable terminal block for12V/1A DC output |
Warranty |
3 Year Warranty |
Intel® 14th (15W) | Intel® 13th (15W) | Intel® 12th (15W) | ||||||||||||
CPU | Ultra 7-155U | Ultra 7-125U | i7-1365URE | i7-1365UE | i5-1335UE | i3-1315UE | i7-1365U | i7-1355U | i5-1335U | i3-1315U | i7-1265U | i7-1255U | i5-1235U | i3-1215U |
DDR | DDR5 (Max. 96 GB) | DDR5 ( Max. 64 GB) | ||||||||||||
Cores / Threads | 12 C / 14 T | 12 C / 14 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T |
P Turbo | up to 4.8GHz | up to 4.3GHz | up to 4.9GHz | up to 4.9GHz | up to 4.5GHz | up to 4.5GHz | up to 5.2GHz | up to 5GHz | up to 4.6GHz | up to 4.5GHz | up to 4.8GHz | up to 4.7GHz | up to 4.4GHz | up to 4.4GHz |
Intel® 14th (28W) | Intel® 13th/12th (28W) | |||||||
CPU | Ultra 7-155H | Ultra 7-125H | i7-1370PE | i5-1350PE | i5-1340PE | i3-1320PE | i5-1350P | i5-1250P |
DDR | DDR5 (Max. 96 GB) | DDR5 ( Max. 64 GB) | ||||||
Cores / Threads | 16 C / 22 T | 14 C / 18 T | 14 C / 20 T | 12 C / 16 T | 12 C / 12 T | 8 C / 12 T | 12 C / 16 T | 12 C / 16 T |
P Turbo | up to 4.8GHz | up to 4.3GHz | up to 4.8GHz | up to 4.6GHz | up to 4.5GHz | up to 4.5GHz | up to 4.7GHz | up to 4.4GHz |
ENBIK RugCon-RV2-T3仅宽21.1厘米,结合了坚固的外壳、低功耗、高效能计算能力和小尺寸下精确的I/O设计,特别适用于机器视觉及自动化控制。该系统还具有千兆乙太网、USB等I/O上的螺丝锁机制,以保证在冲击/振动情况下的连线。RugCon RV2-T3 推论平台是建构机器视觉边缘AI设备的理想选择,可被用于智慧工厂内并被整合进优化品管流程的智慧化自动光学检查(Automated Optical Inspection)。智慧化自动光学检查应用需运用到线性扫描相机(Line Scan Camera)及产品瑕疵辨识AI模型。在上述的智慧化应用中,透过结合合适的影像感测器与AI模型,RV2-T3运算平台可在边缘端进行实时推论作业。支援五个2.5G RJ45 LAN 、4个带PoE网口供电,让使用者能够轻松整合多个摄影机,以截取更多影像或视讯资料进行精准分析。
RugCon RV2-T3是一款低功耗和经济的人工智能加速边缘计算系统,搭载英特尔®酷睿低功耗高效能i7/i5/i3处理器。 配备5个2.5 GbE(4x PoE+可选),1个RS232/422/485,4个USB,8个隔离DIO,5 M.2通讯扩充套件插槽和其他丰富和必要的介面。 透过M.2 2280 PCIE x4扩充套件插槽,它可用于安装人工智能加速卡,使RV2-T3加速边缘人工智慧计算。在电源输入的部分提供6~48V宽压电压输入保护并可支援车辆电源点火开关及远端开关机控制,另外提供一组 12V 直流电源输出,可用于边缘端周边设备的直接协助供电。
在AI的部分, 恩比克RV2-T3支援MXM GPU算力模组,它可以灵活整合EBNIK恩比克自主研发的 MF2A MXM GPU AI算力盒,以提高AI边缘深度学习和推理能力并具备极佳的边缘AI部署成本效益。
IO Interface | ||
USB |
4 |
1x USB 3.0/USB 2.0
3x USB 2.0 |
Display |
2 |
1x DVI-D (1920 x 1200) , 1x DP(4096x 2304) |
Audio |
1 |
1x Mic-In , 1x Line Out |
LAN |
5 |
1x 2.5 GbE with TSN support,
4x 2.5 GbE with PoE+ support 802.3 af/at 25W /48V (PoE+ is option) |
COM |
6 |
1x Isolated RS232/422/485, 3x RS232/422/285, 2x RS232 |
CAN |
0 |
N/A |
DIO |
8 |
4 Channel isolated DI, 4 Channel isolated DO |
Storage | ||
M.2 |
2 |
2x M.2 2280 SATA, support Raid 0/1 |
2.5” |
0 |
N/A |
On Board Expansion | ||
Mini-PCIe
M.2 Expansion |
5 |
1x Full Size Mini-PCIe with SIM supporting 4G/5G/LTE
1x M.2 2242/3052 B key with SIM supporting 5G/LTE 3x M.2 Key E Type 2230 for BT/GPS |
M.2 2280 M key |
1 |
Optional support 1x M.2 2280 Key M ( PCIe x4 ), Support AI acceleration card/image capture card/NVME SSD, etc. |
Mechanical | ||
Mechanical | Dimension : 211(W) x 176(D) x 78(H) mm
Weight : 2.35 kg Mounting : Wall Mount |
Mechanical | ||
AI BOX | Support installing MF1A, this is ENBIK AI BOX which equipped with MXM GPU AI Card |
Environmental | ||
Operating Temp. | -25°C ~ 70°C
-40°C ~ 85°C ( Extended) |
|
Storage Temp. | -40°C ~ 85°C | |
Humidity | 0%~90% , non-condensing | |
Vibration | EN 50155:2017/ IEC 61373, Category I, Class B – Body mounted
MIL-STD-810H, Method 514.8, Category 4 |
|
Shock | EN 50155:2017/ IEC 61373, Category I, Class B – Body mounted
MIL-STD-810H, Method 516.8, Procedure I |
|
EMC | E-Mark, EN 50121 (EN 50155 EMC)
CE/FCC Class A, according to EN 55032 & EN 55035 |
Power |
1x Power Button
1x 3-pin pluggable terminal block for 6~48V DC Input , 1x 4-pin pluggable terminal block forIgnition control and Remote Control 1x 2-pin pluggable terminal block for12V/1A DC output |
Warranty |
3 Year Warranty |
Intel® 14th (15W) | Intel® 13th (15W) | Intel® 12th (15W) | ||||||||||||
CPU | Ultra 7-155U | Ultra 7-125U | i7-1365URE | i7-1365UE | i5-1335UE | i3-1315UE | i7-1365U | i7-1355U | i5-1335U | i3-1315U | i7-1265U | i7-1255U | i5-1235U | i3-1215U |
DDR | DDR5 (Max. 96 GB) | DDR5 ( Max. 64 GB) | ||||||||||||
Cores / Threads | 12 C / 14 T | 12 C / 14 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T |
P Turbo | up to 4.8GHz | up to 4.3GHz | up to 4.9GHz | up to 4.9GHz | up to 4.5GHz | up to 4.5GHz | up to 5.2GHz | up to 5GHz | up to 4.6GHz | up to 4.5GHz | up to 4.8GHz | up to 4.7GHz | up to 4.4GHz | up to 4.4GHz |
Intel® 14th (28W) | Intel® 13th/12th (28W) | |||||||
CPU | Ultra 7-155H | Ultra 7-125H | i7-1370PE | i5-1350PE | i5-1340PE | i3-1320PE | i5-1350P | i5-1250P |
DDR | DDR5 (Max. 96 GB) | DDR5 ( Max. 64 GB) | ||||||
Cores / Threads | 16 C / 22 T | 14 C / 18 T | 14 C / 20 T | 12 C / 16 T | 12 C / 12 T | 8 C / 12 T | 12 C / 16 T | 12 C / 16 T |
P Turbo | up to 4.8GHz | up to 4.3GHz | up to 4.8GHz | up to 4.6GHz | up to 4.5GHz | up to 4.5GHz | up to 4.7GHz | up to 4.4GHz |