RVS-T2FM , 恩比克超迷你手掌大小MXM GPU边缘AI人工智能计算平台
ENBIK RVS-T2FM，超迷你手掌大小的边缘AI人工智能计算平台，配备MXM GPU和桌上型电脑效能英特尔®第13/12核™处理器，支援3x 2.5GbE和NVIDIA GPU高达194 TOPS
- Supports NVIDIA® Ampere/Ada Lovelace TYPE A MXM GPU Module, up to 38W TGP
- Supports Intel® 13th/ 12th-Gen Core™ i9/i7/i5/i3 processor(U_15W/P_28W/H_45W)
- 3x RJ45 LAN (2.5GbE)
- 1x RS232/422/485, 1x RS232
- 6x USB(4x USB3.2 GEN1x1 5Gbps, 2x USB 2.0)
- 1x Mic In/Line Out
- 2x Displays (1x HDMI , 1x DP)
- 2x M.2 2242 SATA III for SSD (1x share with M.2 3052 slot )
- 1x M.2 2242/3052 B key with SIM slot, support 4G/5G
- 1x Full Size Mini-PCIe with SIM slot, support 4G/5G
- 1x M.2 Key E Type 2230 for WIFI/BT/GPS
- 6~48V Wide DC Input Voltage
- Wide operating temperature -40°C ~ 50°C ( 35W GPU TGP)
- Ignition/Remote Power Switch Control
Introduction
ENBIK桌面效能RugCon-RVS-T2FM是一款超迷你手掌大小的边缘AI人工智能计算平台，尺寸仅为145 x 125 x 83毫米，非常适合空间受限的安装部署。 RVS-T2FM将低功耗英特尔®第13/12代酷睿™ i9/i7/i5/i3（15W/28W/45W）处理器与高效能人工智慧计算能力相结合，可以有效解决有限电源的边缘人工智慧部署问题。 RVS-T2FM提供广泛的I/O埠，包括3个区域网（2.5GbE）、1个RS232/422/485、1个RS232、6个USB和多个M.2内部扩充套件插槽，用于5G/4G/WIFI/GPS。 RVS-T2FM还有2个M.2 2242 SATA III插槽，可以同时安装两个固态硬碟。
令人兴奋的是，RVS-T2FM可以支援NVIDIA的MXM GPU，这无疑让软体开发人员更加兴奋。 丰富的NVIDIA软体生态系统使边缘人工智慧部署更快、更容易实施，有效地解决了边缘各种人工智慧模型的安装和低延迟推理问题，并在边缘快速做出各种决策和判断。 模组化GPU可扩充套件性确保无缝升级，以满足不断变化的应用程式需求，ENBIK的RVS-T2FM绝对是各种边缘应用程式中要求苛刻的人工智慧任务、有限空间和有限功率的边缘部署的最佳选择。
Application
适用于边缘AI运算部署、AIoT、机器视觉、AGV/AMR、车载系统、轨道交通、机器人控制和自动化控制，以及安装空间有限、电源供应有限的各种恶劣和极端边缘环境。
| GPU Performance | ||
| RTX4050-35W | 6GB GDDR6 96bit/8.218TFLOPS/194 TOPS/2560 CUDA/80 Tensor/20 RT Core | |
| MX550-35W | 4GB GDDR6 64 bit/4.5 TFLOPS/1024 CUDA/32 Tensor/16 RT Core | |
| IO Interface | ||
| USB |
8 |
6x USB 3.2
2x USB 2.0 |
| Display |
2 |
1x Display Port, 4096*2304@60Hz 1x HDMI , 4096*2160@60Hz |
| Audio |
1 |
1x 3.5mm jack for Mic-In and Line-out |
| LAN |
3 |
3x 2.5 GbE |
| COM |
2 |
1x RS232/422/485,1x RS232 |
| CAN |
0 |
N/A |
| DIO |
0 |
N/A |
| Storage | ||
| M.2 |
2 |
2x M.2 2242 M key (SATA III SSD) , Support Raid 0/1 , (1x M.2 2242 share with M.2 3052) |
| 2.5” |
0 |
N/A |
| On Board Expansion | ||
|
Internal Expansion |
3 |
1x M.2 2242/3052 M-B key with SIM slot, support 4G/5G 1x Full Size Mini-PCIe with SIM slot, support 4G/5G 1x M.2 Key E Type 2230 for WIFI/BT/GPS |
|
MXM Expansion |
1 |
Support TYPE A : 82 x 70 mm MXM GPU Module |
| Mechanical | ||
| Mechanical | Dimension : 145(w) x 125(D) x 85.6(H) mm
Weight : 1.1 kg Mounting : Wall Mount |
|
| Mechanical | ||
| AI BOX | Support installing MFSA, this is ENBIK AI BOX which equipped with MXM GPU AI Card | |
| Environmental | ||
| Temperature |
Operating Temperature : -40°C ~ 70 °C (According to CPU) , GPU TGP 35W ( 50 °C ) Storage Temperature : -40°C to 85°C |
|
| Humidity |
Operating : 0~95%(non-condensing Storage : 10~90% |
|
| Vibration / Shock |
Vibration test according to MIL-STD-810H, Method 514.8, Category 4 Shock test according to MIL-STD-810H, Method 516.8, Procedure I |
|
| EMC |
CE/FCC Class A , according to EN 55032 & EN 55035 , (E-Mark / EN50155 / EN45545-2 by request) |
|
| Power |
|
1x 3-pin pluggable terminal block for 6~48V DC Input 200V/1ms Surge Protection, Reverse-Voltage, Over-Voltage, Under-Voltage, Over-Current Protection 1x Power Button 1x 4-pin pluggable terminal block for Ignition/Remote power control |
| Warranty |
| 3 Year Warranty |
| Intel® 14th (15W) | Intel® 13th (15W) | Intel® 12th (15W) | ||||||||||||
| CPU | Ultra 7-155U | Ultra 7-125U | i7-1365URE | i7-1365UE | i5-1335UE | i3-1315UE | i7-1365U | i7-1355U | i5-1335U | i3-1315U | i7-1265U | i7-1255U | i5-1235U | i3-1215U |
| DDR | DDR5 (Max. 96 GB) | DDR5 ( Max. 64 GB) | ||||||||||||
| Cores / Threads | 12 C / 14 T | 12 C / 14 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T |
| P Turbo | up to 4.8GHz | up to 4.3GHz | up to 4.9GHz | up to 4.9GHz | up to 4.5GHz | up to 4.5GHz | up to 5.2GHz | up to 5GHz | up to 4.6GHz | up to 4.5GHz | up to 4.8GHz | up to 4.7GHz | up to 4.4GHz | up to 4.4GHz |
Introduction
ENBIK桌面效能RugCon-RVS-T2FM是一款超迷你手掌大小的边缘AI人工智能计算平台，尺寸仅为145 x 125 x 83毫米，非常适合空间受限的安装部署。 RVS-T2FM将低功耗英特尔®第13/12代酷睿™ i9/i7/i5/i3（15W/28W/45W）处理器与高效能人工智慧计算能力相结合，可以有效解决有限电源的边缘人工智慧部署问题。 RVS-T2FM提供广泛的I/O埠，包括3个区域网（2.5GbE）、1个RS232/422/485、1个RS232、6个USB和多个M.2内部扩充套件插槽，用于5G/4G/WIFI/GPS。 RVS-T2FM还有2个M.2 2242 SATA III插槽，可以同时安装两个固态硬碟。
令人兴奋的是，RVS-T2FM可以支援NVIDIA的MXM GPU，这无疑让软体开发人员更加兴奋。 丰富的NVIDIA软体生态系统使边缘人工智慧部署更快、更容易实施，有效地解决了边缘各种人工智慧模型的安装和低延迟推理问题，并在边缘快速做出各种决策和判断。 模组化GPU可扩充套件性确保无缝升级，以满足不断变化的应用程式需求，ENBIK的RVS-T2FM绝对是各种边缘应用程式中要求苛刻的人工智慧任务、有限空间和有限功率的边缘部署的最佳选择。
Application
适用于边缘AI运算部署、AIoT、机器视觉、AGV/AMR、车载系统、轨道交通、机器人控制和自动化控制，以及安装空间有限、电源供应有限的各种恶劣和极端边缘环境。
| GPU Performance | ||
| RTX4050-35W | 6GB GDDR6 96bit/8.218TFLOPS/194 TOPS/2560 CUDA/80 Tensor/20 RT Core | |
| MX550-35W | 4GB GDDR6 64 bit/4.5 TFLOPS/1024 CUDA/32 Tensor/16 RT Core | |
| IO Interface | ||
| USB |
8 |
6x USB 3.2
2x USB 2.0 |
| Display |
2 |
1x Display Port, 4096*2304@60Hz 1x HDMI , 4096*2160@60Hz |
| Audio |
1 |
1x 3.5mm jack for Mic-In and Line-out |
| LAN |
3 |
3x 2.5 GbE |
| COM |
2 |
1x RS232/422/485,1x RS232 |
| CAN |
0 |
N/A |
| DIO |
0 |
N/A |
| Storage | ||
| M.2 |
2 |
2x M.2 2242 M key (SATA III SSD) , Support Raid 0/1 , (1x M.2 2242 share with M.2 3052) |
| 2.5” |
0 |
N/A |
| On Board Expansion | ||
|
Internal Expansion |
3 |
1x M.2 2242/3052 M-B key with SIM slot, support 4G/5G 1x Full Size Mini-PCIe with SIM slot, support 4G/5G 1x M.2 Key E Type 2230 for WIFI/BT/GPS |
|
MXM Expansion |
1 |
Support TYPE A : 82 x 70 mm MXM GPU Module |
| Mechanical | ||
| Mechanical | Dimension : 145(w) x 125(D) x 85.6(H) mm
Weight : 1.1 kg Mounting : Wall Mount |
|
| Mechanical | ||
| AI BOX | Support installing MFSA, this is ENBIK AI BOX which equipped with MXM GPU AI Card | |
| Environmental | ||
| Temperature |
Operating Temperature : -40°C ~ 70 °C (According to CPU) , GPU TGP 35W ( 50 °C ) Storage Temperature : -40°C to 85°C |
|
| Humidity |
Operating : 0~95%(non-condensing Storage : 10~90% |
|
| Vibration / Shock |
Vibration test according to MIL-STD-810H, Method 514.8, Category 4 Shock test according to MIL-STD-810H, Method 516.8, Procedure I |
|
| EMC |
CE/FCC Class A , according to EN 55032 & EN 55035 , (E-Mark / EN50155 / EN45545-2 by request) |
|
| Power |
|
1x 3-pin pluggable terminal block for 6~48V DC Input 200V/1ms Surge Protection, Reverse-Voltage, Over-Voltage, Under-Voltage, Over-Current Protection 1x Power Button 1x 4-pin pluggable terminal block for Ignition/Remote power control |
| Warranty |
| 3 Year Warranty |
| Intel® 14th (15W) | Intel® 13th (15W) | Intel® 12th (15W) | ||||||||||||
| CPU | Ultra 7-155U | Ultra 7-125U | i7-1365URE | i7-1365UE | i5-1335UE | i3-1315UE | i7-1365U | i7-1355U | i5-1335U | i3-1315U | i7-1265U | i7-1255U | i5-1235U | i3-1215U |
| DDR | DDR5 (Max. 96 GB) | DDR5 ( Max. 64 GB) | ||||||||||||
| Cores / Threads | 12 C / 14 T | 12 C / 14 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T |
| P Turbo | up to 4.8GHz | up to 4.3GHz | up to 4.9GHz | up to 4.9GHz | up to 4.5GHz | up to 4.5GHz | up to 5.2GHz | up to 5GHz | up to 4.6GHz | up to 4.5GHz | up to 4.8GHz | up to 4.7GHz | up to 4.4GHz | up to 4.4GHz |