



conga-TS370
COM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family
- 8th Generation Intel® Core™ processor with up to 6 Cores
- Intel® Xeon® processors for data center applications
- Support for USB 3.1 Gen2 with 10Gbit/s
- Intel® Optane™ memory support
- ECC memory support
- Up to 64 GByte dual channel DDR4 memory
产品介绍
产品规格
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产品介绍
产品规格
Item | Description |
Formfactor | COM Express Basic |
CPU |
Intel® Xeon® E-2176M (6 x 2.7 GHz, 12MB cache, 45W)
Intel® Xeon® E-2276ME (6 x 2.8 GHz, 12MB cache, 45W)
Intel® Xeon® E-2254ME (4 x 2.6 GHz, 8MB cache, 45W)
Intel® Xeon® E-2276ML (6 x 2.0 GHz, 12MB cache, 25W)
Intel® Xeon® E-2254ML (4 x 1.7 GHz, 8MB cache, 25W)
Intel® Core™ i7-8850H (6 x 2.6 GHz, 9MB cache, 45W)
Intel® Core™ i7-9850HE (6 x 2.7 GHz, 9MB cache, 45W)
Intel® Core™ i7-9850HL (6 x 1.9 GHz, 9MB cache, 25W)
Intel® Core™ i5-8400H (4 x 2.5 GHz, 8MB cache, 45W)
Intel® Core™ i3-8100H (4 x 3.0 GHz, 6MB cache, 45W)
Intel® Core™ i3-9100HL (4 x 1.6 GHz, 6MB cache, 25W)
Intel® Celeron® G4930E (2 x 2.4 GHz, 2MB cache, 35W)
Intel® Celeron® G4932E (2 x 1.9 GHz, 2MB cache, 25W)
|
DRAM | Dual channel DDR4 up to 2666 MT/s | 2x SO-DIMM | up to 2x 32 GByte (optionally with ECC support for Intel® Xeon®) |
Ethernet |
Intel® i219-LM GbE LAN Controller with AMT 12.0 support
|
I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
4 x Serial ATA Gen 3
4 x USB 3.1 Gen 2 @ 10 GBit/s
8 x USB 2.0
1 x PEG x16 Gen 3
LPC bus
I²C bus (fast mode, 400 kHz, multi-master)
2 x UART
|
Graphics | Intel® Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3/4.4 and DirectX 11/12 up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.4 | MPEG-2 , WMV9 (VC-1), H.265 decoding | HEVC, VP9 encoding |
congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control |
embedded BIOS Features |
AMI AptioV® UEFI 2.x firmware
32 MByte serial SPI firmware flash
|
Item | Description |
Security |
TPM 2.0 Infineon SLB9665
|
Power Management |
ACPI 4.0 with battery support
|
Operating Systems |
Microsoft® Windows 10 (64bit only)
Microsoft® Windows 10 IoT Enterprise (64bit only)
Linux
|
Temperature |
Commercial: Operating: 0 .. +60°C | Storage: -40 .. +85°C
|
Extended Temperature | Screening service on request: -25 to +80°C (burn-in & cold-soak) | -40 to +85°C (burn-in & cold-soak) |
Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond |
Video Interfaces |
3x DDI / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k
Dual channel LVDS transmitter, Supports flat panels 2×24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920×1200 Automatic Panel Detection via EDID/EPI
1 x VGA
|
Size | 95 x 125 mm (3.74″ x 4.92″) |
订购资讯
P/N | Product name | Description |
049100 | TS370/E-2276ME | COM Express Type 6 Basic module based on Intel® Xeon® E-2276ME 6-core processor with 2.8GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H Refresh). Chipset CM246. |
049101 | TS370/E-2254ME | COM Express Type 6 Basic module based on Intel® Xeon® E-2254ME 4-core processor with 2.6GHz up to 3.8GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H Refresh). Chipset CM246. |
049102 | TS370/i7-9850HE | COM Express Type 6 Basic module based on Intel® Core™ i7-9850HE 6-core processor with 2.7GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset QM370. |
049104 | TS370/G4930E | COM Express Type 6 Basic module based on Intel® Celeron® Processor G4930E 2-core processor with 2.4GHz, 2MB Intel® Smart Cache, Intel® UHD Graphics 610 and dual channel DDR4 2400 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset HM370. |
049110 | TS370/E-2276ML | COM Express Type 6 Basic module based on Intel® Xeon® E-2276ML 6-core processor with 2.0GHz up to 4.2GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H Refresh). Chipset CM246. |
049111 | TS370/E-2254ML | COM Express Type 6 Basic module based on Intel® Xeon® E-2254ML 4-core processor with 2.5GHz up to 4.2GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H Refresh). Chipset QM370. |
049112 | TS370/i7-9850HL | COM Express Type 6 Basic module based on Intel® Core™ i7-9850LE 6-core processor with 1.9GHz up to 4.1GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset QM370. |
049113 | TS370/i3-9100HL | COM Express Type 6 Basic module based on Intel® Core™ i3-9100HL 4-core processor with 1.6GHz up to 2.9GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset HM370. |
049114 | TS370/G4932E | COM Express Type 6 Basic module based on Intel® Celeron® Processor G4832E 2-core processor with 1.9GHz, 2MB Intel® Smart Cache, Intel® UHD Graphics 610 and dual channel DDR4 2400 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset HM370. |
049000 | TS370/i7-8850H | COM Express Type 6 Basic module based on Intel® Core™ i7-8850H 6-core processor with 2.6GHz up to 4.3GHz turbo boost, 9MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H). Chipset QM370. |
049001 | TS370/i5-8400H | COM Express Type 6 Basic module based on Intel® Core™ i5-8400H 4-core processor with 2.5GHz up to 4.2GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H). Chipset QM370. |
049003 | TS370/i3-8100H | COM Express Type 6 Basic module based on Intel® Core™ i3-8100H 4-core processor with 3.0GHz, 6MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H). Chipset HM370. |
049002 | TS370/E-2176M | COM Express Type 6 Basic module based on Intel® Xeon® E-2176M 6-core processor with 2.7GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H). Chipset CM246. |
相关配件
P/N | Product name | Description |
045930 | TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
045931 | TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
045932 | TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
045933 | TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread. |
045934 | TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
045935 | TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are M2.5mm thread. |
资讯下载
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
Item | Description |
Formfactor | COM Express Basic |
CPU |
Intel® Xeon® E-2176M (6 x 2.7 GHz, 12MB cache, 45W)
Intel® Xeon® E-2276ME (6 x 2.8 GHz, 12MB cache, 45W)
Intel® Xeon® E-2254ME (4 x 2.6 GHz, 8MB cache, 45W)
Intel® Xeon® E-2276ML (6 x 2.0 GHz, 12MB cache, 25W)
Intel® Xeon® E-2254ML (4 x 1.7 GHz, 8MB cache, 25W)
Intel® Core™ i7-8850H (6 x 2.6 GHz, 9MB cache, 45W)
Intel® Core™ i7-9850HE (6 x 2.7 GHz, 9MB cache, 45W)
Intel® Core™ i7-9850HL (6 x 1.9 GHz, 9MB cache, 25W)
Intel® Core™ i5-8400H (4 x 2.5 GHz, 8MB cache, 45W)
Intel® Core™ i3-8100H (4 x 3.0 GHz, 6MB cache, 45W)
Intel® Core™ i3-9100HL (4 x 1.6 GHz, 6MB cache, 25W)
Intel® Celeron® G4930E (2 x 2.4 GHz, 2MB cache, 35W)
Intel® Celeron® G4932E (2 x 1.9 GHz, 2MB cache, 25W)
|
DRAM | Dual channel DDR4 up to 2666 MT/s | 2x SO-DIMM | up to 2x 32 GByte (optionally with ECC support for Intel® Xeon®) |
Ethernet |
Intel® i219-LM GbE LAN Controller with AMT 12.0 support
|
I/O Interfaces |
8 x PCI Express GEN 3.0 lanes
4 x Serial ATA Gen 3
4 x USB 3.1 Gen 2 @ 10 GBit/s
8 x USB 2.0
1 x PEG x16 Gen 3
LPC bus
I²C bus (fast mode, 400 kHz, multi-master)
2 x UART
|
Graphics | Intel® Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3/4.4 and DirectX 11/12 up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.4 | MPEG-2 , WMV9 (VC-1), H.265 decoding | HEVC, VP9 encoding |
congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control |
embedded BIOS Features |
AMI AptioV® UEFI 2.x firmware
32 MByte serial SPI firmware flash
|
Item | Description |
Security |
TPM 2.0 Infineon SLB9665
|
Power Management |
ACPI 4.0 with battery support
|
Operating Systems |
Microsoft® Windows 10 (64bit only)
Microsoft® Windows 10 IoT Enterprise (64bit only)
Linux
|
Temperature |
Commercial: Operating: 0 .. +60°C | Storage: -40 .. +85°C
|
Extended Temperature | Screening service on request: -25 to +80°C (burn-in & cold-soak) | -40 to +85°C (burn-in & cold-soak) |
Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond |
Video Interfaces |
3x DDI / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k
Dual channel LVDS transmitter, Supports flat panels 2×24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920×1200 Automatic Panel Detection via EDID/EPI
1 x VGA
|
Size | 95 x 125 mm (3.74″ x 4.92″) |
订购资讯
P/N | Product name | Description |
049100 | TS370/E-2276ME | COM Express Type 6 Basic module based on Intel® Xeon® E-2276ME 6-core processor with 2.8GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H Refresh). Chipset CM246. |
049101 | TS370/E-2254ME | COM Express Type 6 Basic module based on Intel® Xeon® E-2254ME 4-core processor with 2.6GHz up to 3.8GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H Refresh). Chipset CM246. |
049102 | TS370/i7-9850HE | COM Express Type 6 Basic module based on Intel® Core™ i7-9850HE 6-core processor with 2.7GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset QM370. |
049104 | TS370/G4930E | COM Express Type 6 Basic module based on Intel® Celeron® Processor G4930E 2-core processor with 2.4GHz, 2MB Intel® Smart Cache, Intel® UHD Graphics 610 and dual channel DDR4 2400 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset HM370. |
049110 | TS370/E-2276ML | COM Express Type 6 Basic module based on Intel® Xeon® E-2276ML 6-core processor with 2.0GHz up to 4.2GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H Refresh). Chipset CM246. |
049111 | TS370/E-2254ML | COM Express Type 6 Basic module based on Intel® Xeon® E-2254ML 4-core processor with 2.5GHz up to 4.2GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H Refresh). Chipset QM370. |
049112 | TS370/i7-9850HL | COM Express Type 6 Basic module based on Intel® Core™ i7-9850LE 6-core processor with 1.9GHz up to 4.1GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset QM370. |
049113 | TS370/i3-9100HL | COM Express Type 6 Basic module based on Intel® Core™ i3-9100HL 4-core processor with 1.6GHz up to 2.9GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset HM370. |
049114 | TS370/G4932E | COM Express Type 6 Basic module based on Intel® Celeron® Processor G4832E 2-core processor with 1.9GHz, 2MB Intel® Smart Cache, Intel® UHD Graphics 610 and dual channel DDR4 2400 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset HM370. |
049000 | TS370/i7-8850H | COM Express Type 6 Basic module based on Intel® Core™ i7-8850H 6-core processor with 2.6GHz up to 4.3GHz turbo boost, 9MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H). Chipset QM370. |
049001 | TS370/i5-8400H | COM Express Type 6 Basic module based on Intel® Core™ i5-8400H 4-core processor with 2.5GHz up to 4.2GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H). Chipset QM370. |
049003 | TS370/i3-8100H | COM Express Type 6 Basic module based on Intel® Core™ i3-8100H 4-core processor with 3.0GHz, 6MB Intel® Smart Cache, Intel® UHD Graphics 630 and dual channel DDR4 2666 MT/s memory interface (formerly Coffee Lake-H). Chipset HM370. |
049002 | TS370/E-2176M | COM Express Type 6 Basic module based on Intel® Xeon® E-2176M 6-core processor with 2.7GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H). Chipset CM246. |
相关配件
P/N | Product name | Description |
045930 | TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
045931 | TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
045932 | TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
045933 | TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread. |
045934 | TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
045935 | TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are M2.5mm thread. |
资讯下载