conga-TCV2
COM Express Type 6 Compact module based on AMD Embedded Ryzen V2000 embedded processor series
- High-performance Zen 2 CPU & VEGA GPU
- TDP Range 10-54W
- Supporting 4 simultaneous 4K displays
- Up to 64GByte dual channel DDR4 3200MT/s
- AMD Secure Processor with AMD Memory Guard
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Compact |
| CPU |
AMD Ryzen Embedded V2516 (6 x 2.1 GHz, 3MB L2 cache, 10W)
AMD Ryzen Embedded V2546 (6 x 3 GHz, 3MB L2 cache, 35W)
AMD Ryzen Embedded V2718 (8 x 1.7 GHz, 4MB L2 cache, 10W)
AMD Ryzen Embedded V2748 (8 x 2.9 GHz, 4MB L2 cache, 35W)
|
| DRAM | Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s and ECC support |
| Ethernet |
1 x Gigabit Ethernet via Intel® i226
|
| I/O Interfaces |
5 x PCIe Gen3 (8 lanes)
PEG support x8
4 x USB 3.1 Gen2
8/4x USB 2.0
2 x SATA III (6Gb/s)
2 x UART
8 x GPIOs
LPC bus
|
| Graphics | Integrated Radeon™ graphics engine with up to 7 Compute Units | Supporting 4 independent display units (4x 4K) | DirectX 12 support | VCN2.2 (H.264/AVC HW 8b | H.265/HEVC HW 8/10b | VP9 HW 8/10b) | DP 1.4 |
| embedded BIOS Features |
AMI Aptio® UEFI firmware
16 Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
|
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard
|
| Power Management |
ACPI 5.0 with battery support
|
| Operating Systems |
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Ubuntu Linux LTS
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
|
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces |
3 x DP/DP++
1 x LVDS up to FullHD 1920×1200@60Hz
eDP (optional)
|
| Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
| P/N | Product name | Description |
| 050500 | conga-TCV2/V2748 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2748 8-core processor with 2.9GHz up to 4.25GHz boost freq., 4MB L2 cache, Radeon™ Vega Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
| 050501 | conga-TCV2/V2546 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2546 6-core processor with 3.0GHz up to 3.95GHz boost freq., 3MB L2 cache, Radeon™ Vega Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
| 050502 | conga-TCV2/V2718 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2718 8-core processor with 1.7GHz up to 4.15GHz boost freq., 4MB L2 cache, Radeon™ Vega Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
| 050503 | conga-TCV2/V2516 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2516 6-core processor with 2.1GHz up to 3.95GHz boost freq., 3MB L2 cache, Radeon™ Vega Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
相关配件
| P/N | Product name | Description |
| 050550 | conga-TCV2/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 050551 | conga-TCV2/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 050552 | conga-TCV2/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050553 | conga-TCV2/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050554 | conga-TCV2/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050555 | conga-TCV2/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. |
| 65810 | conga-TEVAL/COMe 3.0 | Evaluation Carrier Board for COM Express Type 6 modules. |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TCV2
2024/10/30
Manual
User’s Guide for conga-TCV2
2024/11/11
产品介绍
产品规格
订购资讯
相关配件
资讯下载
产品介绍
产品规格
| Item | Description |
| Formfactor | COM Express Compact |
| CPU |
AMD Ryzen Embedded V2516 (6 x 2.1 GHz, 3MB L2 cache, 10W)
AMD Ryzen Embedded V2546 (6 x 3 GHz, 3MB L2 cache, 35W)
AMD Ryzen Embedded V2718 (8 x 1.7 GHz, 4MB L2 cache, 10W)
AMD Ryzen Embedded V2748 (8 x 2.9 GHz, 4MB L2 cache, 35W)
|
| DRAM | Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s and ECC support |
| Ethernet |
1 x Gigabit Ethernet via Intel® i226
|
| I/O Interfaces |
5 x PCIe Gen3 (8 lanes)
PEG support x8
4 x USB 3.1 Gen2
8/4x USB 2.0
2 x SATA III (6Gb/s)
2 x UART
8 x GPIOs
LPC bus
|
| Graphics | Integrated Radeon™ graphics engine with up to 7 Compute Units | Supporting 4 independent display units (4x 4K) | DirectX 12 support | VCN2.2 (H.264/AVC HW 8b | H.265/HEVC HW 8/10b | VP9 HW 8/10b) | DP 1.4 |
| embedded BIOS Features |
AMI Aptio® UEFI firmware
16 Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
|
| Item | Description |
| Security |
Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard
|
| Power Management |
ACPI 5.0 with battery support
|
| Operating Systems |
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Ubuntu Linux LTS
|
| Hypervisor |
RTS Real-Time Hypervisor
|
| Temperature |
Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
|
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces |
3 x DP/DP++
1 x LVDS up to FullHD 1920×1200@60Hz
eDP (optional)
|
| Size | 95 x 95 mm (3,74″ x 3,74″) |
订购资讯
| P/N | Product name | Description |
| 050500 | conga-TCV2/V2748 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2748 8-core processor with 2.9GHz up to 4.25GHz boost freq., 4MB L2 cache, Radeon™ Vega Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
| 050501 | conga-TCV2/V2546 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2546 6-core processor with 3.0GHz up to 3.95GHz boost freq., 3MB L2 cache, Radeon™ Vega Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
| 050502 | conga-TCV2/V2718 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2718 8-core processor with 1.7GHz up to 4.15GHz boost freq., 4MB L2 cache, Radeon™ Vega Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
| 050503 | conga-TCV2/V2516 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2516 6-core processor with 2.1GHz up to 3.95GHz boost freq., 3MB L2 cache, Radeon™ Vega Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
相关配件
| P/N | Product name | Description |
| 050550 | conga-TCV2/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 050551 | conga-TCV2/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 050552 | conga-TCV2/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050553 | conga-TCV2/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050554 | conga-TCV2/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050555 | conga-TCV2/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. |
| 65810 | conga-TEVAL/COMe 3.0 | Evaluation Carrier Board for COM Express Type 6 modules. |
资讯下载
文件类型
档案名称
更新日期
下载
Datasheet
Data Sheet for conga-TCV2
2024/10/30
Manual
User’s Guide for conga-TCV2
2024/11/11